Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.
Solderstar WaveShuttle O₂ verification tool. Builds on the original WaveShuttle by adding real-time oxygen measurement to wave soldering process control. Captures seven parameters in a pass, including temperature profile, wave contact, wave height, line speed, inclination angle, vibration and oxygen concentration. Features titanium contact sensors for wave height and line speed measurement, plus a three-axis vibration sensor that detects mechanical instability caused by worn parts or misaligned tooling. Inclination sensors track PCB entry and exit angles at the wave. ESD composite and titanium construction, with custom production sizes available. Integrates with SLX datalogger to separate machine-level variation from PCB-specific issues.