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Model 20X2HC incorporates patented Horizontal Convection technology with 12 vertical zones in a 146" heated tunnel and a 20" wide conveyor. It typically reflows PCBs at 3 to 4' per minute. The horizontal forced air circulation results in a uniform temperature profile along the entire PCB with negligible temperature differentials.

20X2HT (high temperature version) reportedly can precisely match any lead-free or standard solder profile. The onboard computer can store up to 100 profiles.

Options include edge rail conveyor, PC interface Windows software and nitrogen inerting.

Novastar Inc., www.novastarinc.com

In addition to the standard-plastic series MEDI-SNAP circular connector with push-pull locking made out of plastic, a new version with metal housing is available.

The metal connectors are mating and mounting compatible to the plastic version and featuremore than 1.000 mating cycles, a robust version of housing; flexible design of receptacles (receptacles for front or rear panel assembly are available); sever color-coding forms.

ODU GmbH & Co. KG, www.odu.de

Designed mainly for consumer electronics applications using conventional or nitrogen inerted wave soldering systems, Multicore MF101 and MF300 are VOC-free, high activity, no-clean liquid fluxes that meet the legislation on volatile organic compound (VOC) emissions (<1% VOC). Both perform well on low solderability surfaces such as oxidized copper, are formulated to minimize or eliminate solder balling and are non-flammable. MF101 is suitable for spray application only and MF300 can be applied by spray or foam.

MF200 liquid flux is ideal for consumer electronic products and general electrical lead-free soldering applications, especially where there has been a high level of mid-pad solder balling. Said to significantly reduce or eliminate micro solder balling. May also be used with lead-containing alloys.

MFR301 no clean, sustained activity flux is for fast soldering on conventional leaded and SMD components. The activator package is similar to a previous product, but the acid value has been increased to enhance efficacy when soldering to poorly preserved substrates and components. Ensures optimum drainage characteristics at the exit of the wave, which minimizes bridges, spiking and mid-pad solder balling. Can be applied by foam, spray or wave.

Henkel, www.henkelelectronics.com