ALPHA EF-8000 lead-free, no-clean wave solder flux technology is said to provide excellent first pass yields, worry free in-circuit testability and electrical reliability in both lead-free and tin lead wave soldering applications.
IPC rated ROL0, exceeds the Bellcore and JIS standards for electromigration and surface insulation resistance, as well as more stringent electromigration and bulk insulation resistance requirements from leading OEM's.
"ALPHA EF-8000...withstands the higher PWB surface temperatures required for successful lead-free soldering, but it is fully capable for use in standard tin-lead applications," said Mitch Holtzer, Global Product Manager at CEAM. "In addition, it can be qualified now for emerging lead-free requirements, and used in lead-free or tin lead production lines."
Low rosin content minimizes flux residue build up on pallets and wave soldering equipment normally associated with high (>10%) rosin flux formulas.
Cookson Electronics Assembly Materials, www.alphametals.com
Leica INS300 fits the demands of IC manufacturers for equipment with optimized price/performance ratio.
Designed based on the field-proven INS3300 inspection and review system, successfully used in production for almost four years and takes the increased price and cost pressure in the semiconductor industry into consideration. Provides manual inspection of 300 mm wafers. Can be integrated into 300-mm facilities for complete automation of the process flow, resulting in production runs of more than 150 wafers/hr.
Leica Microsystems, www.leica-microsystems.com