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Ann Arbor, MI - Beige Bag Software Inc., a circuit design tool designer, has signed an agreement with engineering consulting company Zuken for the inclusion of B2 Spice circuit simulation software in Zuken's CADSTAR promotional bundles for the Americas. 

B2 Spice Professional CS directly integrates with the desktop PCB design solution, providing analog, digital and mixed mode circuit simulation.  The company is currently in the process of advanced development for further integration into the CADSTAR design environment. Coding for the first stage of integration has already been completed.  Beige Bag is also planning to release B2 Map CS a collection of tools for the automatic mapping of simulation models for CADSTAR user libraries.

www.beigebag.com

www.cadstarworld.com/americas

 

AMP Economy power (EP) connectors are designed for secondary power circuit applications and consist of a wire-to-board plug housing receptacle and a mating post header. Available in three contact spacings: .156", .200" and .312"; headers are available in vertical and right angle configurations. Applications can be found in commercial electronic equipment, household appliances and other general-purpose industrial and commercial applications where secondary power circuits are designed in.

Equipped with a positive locking mechanism for effective locking of the connector halves. The positioning of the locking latch avoids interference with potting or other surface treatments found on the circuit boards in home appliances. The slim design of the post headers allows end-to-end stacking to help improve flexibility and density on the PCB. Available in two through twelve positions in the .156" and .200" version and two through five positions in the .312" version.

Rated at 250 VAC and 7.5 amps maximum. Wire with a maximum insulation diameter of .118" and ranging from 18 through 22 AWG can be connected to the receptacle contacts. Initial resistance is rated at 10 m ohms and 20 m ohms final. Durability is rated at up to 50 mating cycles. Intermateable with other competitive designs. A high profile, single position plug housing and header are also available.

ELV & RoHS compliant, lead-free process capable.

Tyco Electronics, www.tycoelectronics.com

 

 
MVP is expanding its capabilities to include the application of wire bond to its newly introduced Supra M AOI system.
 
Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry and contamination can easily be detected with the wire bond configuration.

The system is modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format color digital camera, specialized illumination and a high-precision linear x/y stage in a 960 x 965 mm footprint. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 11 to 15 mm/pixel. The system has CAD-driven, library-based programming.

 Machine Vision Products Inc., machinevisionproducts.com 

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