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SensArray Corp. announced an Assembly and Test Business Unit to deliver process optimization tools specifically for backend semiconductor manufacturers. The unit currently markets six applications as well as custom control systems to ensure optimum performance and better yields during wafer bumping.

"Present instruments currently used to control processes such as solder reflow and curing polymer coatings have become inadequate due to their lack of accuracy and sufficient channels of data measurement and analysis," said Phil Marcoux, Assembly and Test manager. "SensArray is leveraging its reputation for leadership in process optimization tools for front end IC manufacturing by supplying a set of measurement and control solutions that provide temperature accuracy, stability and calibration for the backend market."

With process optimization tools and measurement systems, regular profiling can reveal potential process problems before manufacturers realize a reduction in yields, which necessitate high rework requirements. SensArray has created a system bundle from its current tools for measuring real time, in situ temperature in backend processes.

The bundle includes: Process Probe1935 thermocouple (TC)-instrumented wafer; Process Prob3 1630 TC-instrumented wafer; Process Probe Custom Reflow; PDA-based Thermal TRACK measurement systems; laptop-based Thermal MAP metrology systems; and the Intelligent Sensor Interface System (ISIS).

SensArray, www.sensarray.com

EM8D-100L is a 16-pin DFN package, eight-line low pass filter array with integrated TVS diodes. Is designed to suppress unwanted EMI/RFI signals and provide ESD protection for high-speed data interfaces such as color LCD displays, camera imagers in mobile phones and PDAs.

With a desired cutoff frequency of 150MHz, provides good EMI/RFI attenuation. Blocks the RF noises from GSM, DCS or Bluetooth, which affect the baseband chipset and other blocks. Meets the immunity test standard IEC 61000-4-2 at all levels.

In standby mode, the integrated TVS filter has a very low leakage current (less than 100µA) - an essential feature for battery powered handheld devices. Low profile durable 16-pin DFN package is useful in many applications.

ProTek Devices, protekdevices.com

Universal Instruments Corp. has designed an advanced assembly line that can assemble over 2000 flip chips per hour on flexible circuits.

The substrate is a thin flexible circuit that is normally processed in a carrier with eight to 12 circuits. Each comprises a 3 to 5 mm sq. pre-amplifier chip, five to 10 discretes and a connector.

An optimized line consists of a screen printer to apply solder paste, a chipshooter to pick-and-place the chip capacitors and the connector, a flip-chip placement machine with integrated dip fluxing and a reflow oven. For applications with high capacitor counts, two chipshooters would be required.

Universal’s chip placement platform configurations incorporate the company’s Variable Reluctance Motor (VRM) linear motors, featuring dual drives and one-micron linear encoders. Said to provide high accuracy and high speed, and enables the machines to be used in clean room environments. VRM technology is also at the heart of the 30-spindle rotary Lightning head – a chip placement solution that is smaller than mechanical turret heads typically deployed to place small discrete components. In addition, a four-spindle Pressure Enhanced (PE) head is used to place challenging components that demand higher accuracy. The PE head is used in conjunction with the Magellan camera – a high resolution digital Upward Looking Camera (ULC).

For the equipment designers, a major technical barrier was accurately imaging the component. The development project identified a need for a lighting module that integrates both blue and red LEDs to handle the wide spectrum of materials, such as polyimide, copper, etc. The team also redesigned the dip fluxing unit to be able to gang dip several components concurrently by adopting a linear versus a rotary mechanism..

The optimal tact time for the line is 20 to 25 sec. A twin-beam GSM Genesis platform equipped with two Lightning heads handles the discretes and the connectors. A second platform machine featuring a linear motor positioning system and a four spindle head combined with the Magellan ULC places all the flip chips to an accuracy of +/-9 microns at +/-3 sigma. Both machines are certified UL, CE, SEMI S2 and SEMI S8.

Universal Instruments Corp., www.uic.com