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Tokyo, Japan --  Nihon Almit Co., Ltd., a manufacturer of solder wire and paste, has created two new Pb-free solder pastes to eliminate VOIDE. TM-HP has high preheat 200°C for 120 sec., and TM-HP (L) features high preheat 190°C for 120 sec.

The pastes are manufactured in accordance with IPC TM-650 and IPC J-STD 005.  The main stream alloy in Pb-free soldering is Sn/Ag/Cu and is available in variations such as: Ag3.0% / Cu0.5%, Ag3.9% / Cu 0.6%  (NEMI recommended) and Ag3.5% / Cu 0.7%.

Nihon Almit will attend the CAVE Harsh Environment Workshop in Indianapolis on June to speak on various aspects of Sn/Ag/Cu alloys. 

The company recently announced that leading Japanese automotive manufacturers have decided to specify Almit Pb-free solder for many of their applications.

For questions, contact ANA Trading Corp. U.S.A.: almit@anatu.com or (310) 965-8165.

959T is an alcohol-based, no-clean liquid flux for lead-free wave soldering applications. Is also backward compatible with tin/lead wave soldering operations.
 
Benefits include optimized wetting properties and, according to the company, the shiniest solder joints of any no-clean, solvent-based chemistry.  With a typical solids content of 2.9%, the flux leaves evenly distributed residues. Contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. Designed to minimize the incidence of micro-solderballs. 

Can be applied to circuit boards by a spray, foam or dip process. Non-corrosive, halogen-free, Bellcore-compliant and classified ORL0 per J-STD-004.  Flux residues are non-conductive and do not require removal in most applications.

Kester, www.kester.com

 

Designed for I/O port protection on USB 2.0, IEEE 1394, digital visual interface (DVI) and antenna switches, PESD0402 and 0603 electrostatic discharge (ESD) protection devices are available in popular form factors. The RoHS-compliant devices shunt ESD away from sensitive circuitry in HDTV equipment, printers, laptops, cellular phones and other portable devices.

Utilize advanced thick film technology to provide low capacitance (typically 0.25 pF) for ESD protection in high-speed data transmission applications. The devices perform better than comparable components in transmission line pulse (TLP) testing. Offer lower trigger and clamping voltages than typical polymeric ESD devices, resulting in improved protection of sensitive electronic components. Said to perform better in IEC61000-4-2 testing, especially after multiple hits (up to 1000).

Available in standard EIA sizes 0402 and 0603, with a quad-array in 1206 coming soon. Compatible with standard surface-mount and reflow installation procedures, available in tape and reel packaging.
 
Raychem Circuit Protection, www.circuitprotection.com, a unit of Tyco Electronics, www.tycoelectronics.com

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