Circuits Assembly Online Magazine - Current Issue

Products

Continuing its policy of providing a global solution for its global customers, PXI solutions provider Pickering Interfaces is improving its service in Mexico with the appointment of a local Mexican distribution partner. Aimed at serving existing electronics manufacturing sites in Mexico as well as companies who are moving into the region, LogicBus SA de CV provides sales and service around the major production areas of Mexico (Guadalajara, Tijuana and Monterrey).

LogicBus, www.logicbus.com.mx

Pickering Interfaces, www.pickeringtest.com

Tokyo, Japan -- Nihon Almit Co., Ltd., a manufacturer of solder wire and paste, has created two new Pb-free solder pastes to eliminate VOIDE. TM-HP has high preheat 200°C for 120 sec., and TM-HP (L) features high preheat 190°C for 120 sec.

The pastes are manufactured in accordance with IPC TM-650 and IPC J-STD 005. The main stream alloy in Pb-free soldering is Sn/Ag/Cu and is available in variations such as: Ag3.0% / Cu0.5%, Ag3.9% / Cu 0.6% (NEMI recommended) and Ag3.5% / Cu 0.7%.

Nihon Almit will attend the CAVE Harsh Environment Workshop in Indianapolis on June to speak on various aspects of Sn/Ag/Cu alloys.

The company recently announced that leading Japanese automotive manufacturers have decided to specify Almit Pb-free solder for many of their applications.

For questions, contact ANA Trading Corp. U.S.A.: almit@anatu.com or (310) 965-8165.

959T is an alcohol-based, no-clean liquid flux for lead-free wave soldering applications. Is also backward compatible with tin/lead wave soldering operations.

Benefits include optimized wetting properties and, according to the company, the shiniest solder joints of any no-clean, solvent-based chemistry. With a typical solids content of 2.9%, the flux leaves evenly distributed residues. Contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. Designed to minimize the incidence of micro-solderballs.

Can be applied to circuit boards by a spray, foam or dip process. Non-corrosive, halogen-free, Bellcore-compliant and classified ORL0 per J-STD-004. Flux residues are non-conductive and do not require removal in most applications.

Kester, www.kester.com