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ERSA IR / PL 650 A third-generation IR rework system offers three new technological innovations: DynamicIR, Multi True Closed Loop Control and IntelligentIRS. Designed to handle rework applications on heavy mass PCBs and large-format SMT assemblies (18 x 20" / 460 x 560 mm) in a lead-free environment.
 
The safe and proven medium wavelength IR heating technology allows uniform heat distribution from the top and bottom side across the PCB and component. DynamicIR allows fully automatic dynamic control of the top (1400W / 60 x 120 mm) and bottom (3200W / 350 x 450 mm) IR heaters depending on the actual temperature of the component and where it is in the temperature profile. Total available power to the selective reflow system is spread across four separately switchable heating zones on the top and five zones on the bottom. Depending on board size, the thermal mass of the substrate and component size, the required heat energy is delivered at the precise time and location to ensure that component and board follow the prescribed temperature profile. Can run an extended or flat peak, reduces PCB warpage.
 
True Closed Loop Control means that the actual component temperature is acquired, using the non-contact Infrared sensor, and is used as the primary control mechanism for the heating system. IntelligentIRS allows for precise temperature measurement by choosing from a component table or by component-specific IRS calibration.  Either the IRS or a TC sensor of choice can be chosen to drive the heating technology. Multi True Closed Loop Control uses up to four additional TC sensors. By assigning threshold values to these additional sensors, they prevent the fully automatic heating system from undesired overheating of adjacent or bottom side components.
 
Affords a high level of rework safety by y making it impossible to heat over an assigned threshold value. Thus, it is impossible to work outside a specified lead-free process window.
 
The system is broken down into four modules: the IR650 Selective Reflow module, the RPC Reflow Process Camera module, the PL650 Precision Placement module and the IRSoft software module.
 
ERSA, ersa.de/en/

 

Delivering electrical conductivity for attachment of ICs and components to metallic lead frames, Loctite QMI529HT is a highly silver filled conductive adhesive designed to provide high thermal conductivity. Hydrophobic and high-temperature stability characteristics produce void-free bond lines with adhesive strength, enabling adhesion to a variety of metals and ceramic surfaces, including copper, silver-plated copper and pre-plated leadframes. The bismaleimide (BMI) formulation also said to have particularly robust adhesion to NiPdAu leadframes.
 
Designed as a soft-solder replacement or for applications that require high thermal or electrical conductivity, reportedly achieves UPHs that are higher than conventional oven cured adhesives.  With e fast cure kinetics and very low volatiles, can be SkipCured on the diebonder or wirebonder preheater. 
 
To control bondlines and fillet heights, can also be converted into a controlled collapse spacer paste. 
 
Henkel, www.henkelelectronics.com
 

Transition Automation has a new squeegee holder which is said to improve SMT printing by incorporating a self-cleaning wiper system. 

Reduces solder paste sticking by way of two small articulating wiper wires. Results may vary depending on the particular viscosity and rheology of the solder paste.  In some cases, users may benefit by altering their solder paste formulations to be more sticky and viscous (which improves printing), without the additional paste sticking worries. The new devices is offered across the full Permalex metal squeegee product line, and may be retrofitted on most popular SMT printing machines. 

No additional hookups or machine interefacing required, is passively actuated by the motion of the squeegee holder.

Transition Automation Inc., www.transitionautomation.com

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