caLogo

Products

SM-700 ESD plastic belt, modular conveyor system transports everything from PCBs to totes. Available in belt widths from 6 to 30", and lengths from 5 to 40'.
 
Standard features include: modular ESD-compliant belting system, variable speed DC drive motor and 1" tall side rails (removable).
 
Also available in a lift gate (passageway system) for continuous flow of products. When the gate is lifted, the belt shuts down and allows for passage through the line.
 
Other options include: crossover transition bars, heavy duty cycle motors (for heavier product loads), side mounted guide rails, 90° safety corner blocks, end stops, chutes and integrated workstations.
 
Promation,  Pro-mation-Inc.com

Mentor Graphics Corp. released version 2005.1 of the Capital Harness Systems (CHS) product suite, an end-to-end software toolset for the design, analysis, engineering and production of electrical interconnect systems such as those found on transportation platforms. Users can select from a range of fully integrated tools.

Version 2005.1 contains more than 140 separate enhancements across the various software tools, including:

*            Preferred component declaration and selection

*            Configurable release behaviors

*            Extended name composition capabilities

*           Support for connector backshells

*            Configurable cross-referencing

*           Flexible electrical analysis scoping

*           Whole vehicle wiring diagram synthesis

*           Layered insulation display

*            Additional cost modeling variables

*           First integration capabilities with UGS TeamCenter Engineering

Mentor Graphics Corp., www.mentor.com

UK-based MicroStencil launched a new production facility for the manufacture of ultra-fine pitch screen printing stencils.

Following its spin-out from Edinburgh's Heriot-Watt University, additional investment has now enabled the company to expand stencil manufacturing at its headquarters in Livingston with the installation of a class 100 cleanroom and customized production equipment based on the semiconductor manufacturing processes.

The company provides an electroformed stencil that allows the fabrication of sub-100 micron aperture pitch. The stencil has the potential to deliver considerable advantages in interconnecting technology and offers in screen printing for wafer bumping and chip bonding.

The process forms high tolerance apertures with extremely smooth sidewalls. Such stencils are beginning to enable printing at sub-150 micron pitch. While current methods of applying solder bumps using stencil printing cannot cost-effectively get below a 150µm aperture pitch, severely restricting the use of flip-chip packaging, MicroStencil can push the limits down to 10µm aperture size and 10µm web space.

The technology achieves high-density electrical interconnects leading to higher portability and functionality in portable electronics devices.

www.micro-stencil.com 

Page 1915 of 2036

Don't have an account yet? Register Now!

Sign in to your account