Carlsbad, CA — Machine Vision Products (MVP) will highlight the Supra M AOI system in booth 8650 at Semicon West this week in San Francisco, CA.
Modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format digital camera and a high-precision linear x/y stage. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 15 to 22 mm/pixel. Has CAD-driven, library-based programming for precise measurement of component placement and solder joint analysis.
In a 960 x 965 mm footprint, provides an acquisition speed of 20 1.4 images/sec. Can achieve up to 45 sq. cm./sec., depending on board layout and density.
Offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. Includes on-the-fly single camera acquisition, improved optics and lighting, 0201 capability and adaptable algorithms with high detectability and low PPM false accept and false reject rates.
Machine Vision Products Inc., sales@machinevisionproducts.com
IS640-333 has a nominal dielectric constant of 3.33 at 10 GHz and a dissipation factor of 0.0038 at 10 GHz. Available in standard 20, 30 and 60 mil thickness configurations. Other configurations may be available on request. Launched to target the low noise block (LNB) down converter market.
The complete family of IS640 patent-pending products are formulated to provide exceptional thickness and dielectric constant control without using inorganic fillers.
IS640-333, IS640-338, IS640-345, IS640-325, IS640-320 and IS640-300 are manufactured in Isola’s Chandler, AZ facility.
Isola Group S.A.R.L., www.isola-usa.com
Universal Instruments Corp. has designed a line that can assemble 2,000 microprocessors per hour (supposedly 60% to 80% faster than existing lines).
GSM Genesis platform features a twin beam gantry system and proprietary linear motors based on the company’s Variable Reluctance Motor (VRM) technology. Each beam can support one of three different heads: 30-spindle rotary Lightning head – a chip placement solution with VRM technology that is smaller than mechanical turret heads typically deployed to place small discrete components; a seven spindle Flexjet head with integrated cameras to handle a range of components; or a four spindle Pressure Enhanced (PE) head used in conjunction with a high resolution digital upward-looking Magellan camera to place challenging components that demand higher accuracy.
A chipshooter platform configured with two Lightning heads can assemble 32,000 to 37,000 capacitors/hr. Optimal tact time for the line is between 18 and 20 sec. A module comprising 16 to 20 capacitors can be addressed by a single chipshooter platform, while modules with 20 to 40 capacitors require a second chipshooter.
A flip chip platform features two PE heads. The machine’s motion control parameters – such as acceleration, settling band and stabilization time – are said to deliver higher accuracy. A special low-viscosity fluxer is integrated on the machine. With the flip chips fed in waffle packs, can assemble 2,000 flip chips/hr.
Universal Instruments, www.uic.com