Speedline Technologies has announced several lead-free upgrades for its line of Electrovert Wave Soldering Systems.

40% wider than the traditional tin/lead nozzle, the UltraFill Nozzle increases both contact length and dwell time. The nozzles are placed closer together to reduce the temperature drop between the nozzles – so less superheat is needed to reflow solder joints in the second wave. As a result, hole fill is improved and bridging is reduced. There’s no requirement to slow the conveyor and dross generation is reduced.  The nozzles are available in Melonite Corrosion Resistant Stainless Steel or Titanium Material. 

An optional Nitrogen shroud is available for use with the Nozzle. Allows for either air or nitrogen operation, as determined by the desired recipe, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and reduces dross formation in nitrogen environments. Lifts for easy maintenance and dedrossing without nozzle removal. 

Quick Change Solder Pot provides the capability to easily switch between two alloys, such as between tin/lead and lead-free solders.  The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and two trolleys.

Both upgrades are available as an option on new or existing, installed Electrovert EconoPak Gold, Electra and Vectra systems.

Other available upgrades include:

• High Velocity Convention (HVC) Topside Preheater, for even topside preheating and tighter Delta T’s across the board;

• Reciprocating Spray Fluxing Technology, featuring UltraSpray technology for precise flux deposition, improved through-hole penetration and low maintenance requirements;

• Vectaheat Bottomside Preheater, providing efficient, even high thermal mass heating.

Speedline Technologies, speedlinetech.com