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Products

Launched at the Semicon Europa show in April, two of the LDS3300 C models have already been delivered to the North American fab of a major semiconductor manufacturer. Additonal installations for this client are expected soon in European facilities.

“Conceived for perfect integration into automated fab lines, our new system combines micro and macro defect detection for all 300-mm wafer applications,” said Thomas Breser, strategic marketing & communications director. “This is an important part of why our client chose the LDS3300 C.”

As part of the automated macro inspection process, provides automated reticle and fuse inspection capabilities. High throughput (up to 130 wafers/hour) helps increase yield and reduce cost of ownership.

Focal plane analysis has high accuracy and efficiency in scanner focus calibration and monitoring, and scanner e-chuck flatness measurement and monitoring.

Leica Microsystems, leica-microsystems.com

Ashburn, VA – Zestron’s VIGON A 200 recently passed extensive surface insulation resistance (SIR) testing conducted in accordance with J-STD 001.

To conduct the testing, an IPC B24 test comb structure was cleaned with the water-based cleaning agent in a spray-in-air process. During the four-day procedure, the climatic storage temperature was calibrated at 77^oF / 25^oC, while the relative humidity was set at 60%. The test comb’s SIR values were continuously monitored and were reportedly consistently well-above the required 100 ΜΩ. Further inspection did not reveal any dendrites or corrosion effects.

The cleaner is designed to remove flux residues from electronic assemblies.

For complete results of the testing, contact the Application Technology Department at (888) 999-9116.

WS330 is a compact wave soldering machine for small- and mid-size volumes in standard and lead-free technology. Solder width up to 330 mm and the universal pallet transport system allows for a variety of PCBs. Equipped with a dual-wave technology, allowing THT and SMD components to be soldered.

Includes full convection preheating, spray fluxing system and composite coated parts.

Said to offer small delta-T values, precise hot air flows and a closed loop.

Microprocessor-controlled temperature cycles ensure fast preheating. High temperature efficiency enables a shorter preheat zone

Coating of the solder pot and wave elements enables production with lead-free solder. The coating is applied after the complete pot is finished, eliminating possible problem areas. All parts in contact with the solder are coated (pot, pump, channel).

Available with spray or foam fluxer. Spray fluxing features automatic board detection.

Equipped with a universal palette transportation system based on an antistatic belt. Has ergonomic loading/unloading heights.

ESSEMTEC AG, essemtec.com