Products
The FS2500N flip chip packaging system is reportedly capable of aligning and bonding at 1.7 sec. per chip at 2 micron accuracy. Underfilling chip with gaps of 14 microns has reportedly been demonstrated in production volume with zero voids. Said to be capable of bonding via thermocompression by pulse heating head, thermosonic by 50 KHz ultrasonic system, Au/Au, Au/Sn and solder. Reported chip sizes of up to 20 x 20 mm with more than 800 bumps and pitches of less than 40 microns.
Toray Engineering Co., Ltd., www.toray.com
Toray Engineering Co., Ltd., www.toray.com
CadStar Express includes all the latest features of CadStar 9.0, with a limit of 300 pins and 50 components. A back annotation function is said to smooth file transfer from PCBs into schematics, assisting in ECO management -- particularly those associated with high-speed designs. A Do-It-Yourself booklet was created to guide the user step-by-step through the solution using design examples. The free tool can be downloaded at www.cadstarworld.com/express.
Zuken, www.zuken.com
Zuken, www.zuken.com
The TouchPrint fully automatic stencil printing system (TP2929) reportedly offers less than 5 sec. preprint, as well as accuracy at 12.5 µm and 25 µm respectively. Is a split plane operation and has integrated resistive touch monitor. Feature a bottom-side stencil wiper, vibration squeegee technology and Grid-Lok based bottom-side tooling. Includes digital scan vision, single flying overhead camera gantry operation, passive axis design and an automatic two-cartridge paste dispenser.
Milara, www.milarasmt.com
Press Releases
- Adam Ryder appointed as Managing Director of Incap UK
- Metal Etch Services Opens New Motor City Facility to Meet Growing Midwest Demand
- Yamaha surface-mount line powers the future of specialized production at Inter-Company in Netherlands
- Matric Group Becomes the First U.S. Manufacturer to Deploy Panasonic NPM-GH Dual Lane SMT Technology