AkroMetrix will display its latest product, the LineMoiré automated flatness measurement system, Model J5000, at Semicon West booth #8301.
The high-speed, full-field shadow moiré technique allows for flatness measurement of chip-carriers/substrates, packages and ICs in JEDEC (or similar) trays. Can measure the full contents of a tray simultaneously (with one-sec. data acquisition time per tray), has integrated tray stack/destack and part sorting capabilities. Can measure stacks of trays, replace “bad” parts (i.e., parts that fail a user-specified warpage specification) with known good parts, and then stack good and bad trays separately. This is important for incoming/outgoing inspection of parts. Enables flatness characterization before any value added processing is performed.
COMET has added an upgrade to its Feinfocus Cougar X-Ray platforms: Computerized Numerical Control (CNC). This enables operators to program and automate x-ray inspection procedures, as well as perform 2-D measurements of hidden details during failure analysis without the need for calibration.
CNC provides numerous benefits, facilitating an efficient failure analysis process. With the ability to program the manipulation system of the platform, CNC can automatically position the optical overview camera in the optimal position for inspection. Operators can even program the entire inspection process with CNC, including x-ray parameters and image processing, eliminating costly variables associated with manual control. User-friendly “teach-in” buttons enable easy programming.
The platform provides x-ray inspection for a range of inspection needs, from 2-D failure analysis of manufacturing components to advanced 3-D imaging of complex BGA and wafer-level packages. Has a small, ergonomic design, small footprint (approximately 1 m x 1 m), low system weight (approx. 1,450 kg) and convenient front- and side-door service access. Includes a microfocus x-ray tube up to 160 Kv, standard 5-axes manipulator with Auto Isocentric Motion (AIM) Technology for oblique viewing, CNC Capabilities, HDX-Ray real-time 16-bit image processing, digital flat panel detector and a hardware-driven anti-collision system.
PCB Probe Kit provides new or additional test points on PCBs. Engineers attempting to debug an existing system will find this tool useful for hands-free probing and viewing signals on a logic analyzer, oscilloscope, meter or other instrument.
The following components are included: arm probe with a heavy base, spring loaded tip, rotatable head and fine vertical adjustment knob for precise positioning to adjacent test points; small lead clips enabling quick connection to SMD leads from 0.5 to 0.2 mm lead pitch; large lead clips for connection to leads from 1.25 to 0.3 mm lead pitch; SMD clips in four sizes (0201, 0402, 0603, and 0805); SMD clip support with guide wire; and an integrated magnifying glass with tweezers.