Products
The SM321 pick-and-place machine is said to assemble up to 21,000 cph at ±50 µm accuracy, based on IPC-9850. It places QFPs and BGAs at speeds up to 5,500 cph at ±30 µm accuracy. Handles boards up to 20 x 24" at production speed. Comes with high-resolution flying vision system and enhanced board handling capabilities.
Has a low mass head mechanism with high speed motor to deliver a stable motion platform for consistent, on-target placements. The board transport system features an enhanced drive system with a flat handling system to safely move large PCBs and thin, flexible substrates. Is configured for Samsung SM Series slim format tape feeder system; handles EIA-481 tape sizes, and holds a maximum of 120 8-mm feeders. Tape feeder monitors inventory on the supply reel and notifies before replenishment is needed. A one-touch clamping feature permits users to replace tape feeders during operations, while the system's endless-discharge method for non-stop operation provides efficiency, reliability and repeatability of component pickups. Performs complete lot tracking and inventory management, and automatically optimizes placement sequence.
Samsung Techwin/Dynatech Technology www.dynatechsmt.com
Has a low mass head mechanism with high speed motor to deliver a stable motion platform for consistent, on-target placements. The board transport system features an enhanced drive system with a flat handling system to safely move large PCBs and thin, flexible substrates. Is configured for Samsung SM Series slim format tape feeder system; handles EIA-481 tape sizes, and holds a maximum of 120 8-mm feeders. Tape feeder monitors inventory on the supply reel and notifies before replenishment is needed. A one-touch clamping feature permits users to replace tape feeders during operations, while the system's endless-discharge method for non-stop operation provides efficiency, reliability and repeatability of component pickups. Performs complete lot tracking and inventory management, and automatically optimizes placement sequence.
Samsung Techwin/Dynatech Technology www.dynatechsmt.com
The Pyramax 125 Air solder reflow oven is optimized for lead-free processing. Has an ergonomic design that provides easy access to all
maintenance points, maximizing uptime. Thermal performance is achieved
by precision control of critical thermal processing variables. Uses novel Closed Loop Convection Control to control heating and cooling. Constant heat transfer optimizes process control flexibility, and improves process repeatability from site to site
and line to line. Features side-to-side
recirculation, which enhances temperature uniformity, user-friendly Windows-based WINCON®
oven control software, a wide range of flux management options, advanced
conveyor solutions and smart tracking SMEMA.
BTU International, www.btui.com
BTU International, www.btui.com
The SVS Ascent platform is for in-line, 3-D SMT inspection of solder paste depositions and component placement process control. Handles boards up to 20 x 24". Features an all-solid-state laser scanning platform with a reported 8 MHz data acquisition rate, all digital processing, and 8X oversampling. Analyzes data pixel by pixel, without merging or blending areas of acquired data. Said to permit panel setup from CAD data within 10 minutes and to detect flaws in volume, area, height, x/y position, coplanarity and bridging.
GSI Group, www.gsig.com
GSI Group, www.gsig.com
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