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440-R SMT Detergent is available in a ready-to-use spray bottle for safe, effective manual cleaning of SMT stencils and related tooling.  The stencil-cleaning chemistry  is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program. 
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly.  Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user.  This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning. 
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027
Speedline Technologies has added a chemical isolation option to its Accel MicroCel S2 centrifugal cleaning system. This platform enhancement improves existing zero-discharge systems and extends the life of mixed-bed deionizing resins.   

The open programming platform and interface are said to make the chemical isolation option simple to set up. The system can be configured as a complete on-board, internal closed-loop recycle system, and as such the option can reduce operating costs. 

The chemical isolation option will help minimize the amount of residual chemistry carried from the process chamber to the rinse vessel. The system can then reprocess the used rinse water through the internal closed-loop recycle system without contaminating the mixed bed deionizing resins, then recharge the rinse water to its previous deionized state.


Speedline Technologies, speedlinetech.com

FEINFOCUS HDCT-FOX  2-D/3-D x-ray inspection system combines high-resolution 2-D X-Ray technology and enhanced 3-D computed tomography techniques with Feinfocus HDX-Ray technology for inspection and analysis of complex electronic devices in the third dimension. For thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects and hybrids.
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.

Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.

Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.

COMET, comet.ch

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