Circuits Assembly Online Magazine - Current Issue

Products

The KE-2080 high-speed flexible mounter is a sixth-generation multi-purpose mounter featuring six nozzles that have a laser alignment and an additional IC head for fine-pitch components. The system has a reported IPC-9850 speed of 15,400 cph, 23% faster than its predecessor.

Handling ranges to 01005 placement capability (0402 in metric) and up to 33.5 mm sq. The LNC60 laser align sensor, which includes laser-centering placement capability for most 1.27 mm pitch BGAs and an optional placement load control, can measure six parts simultaneously. Step motors control the input and output buffer conveyors, enhancing speed. Data, feeders, nozzles and floor trolleys are interchangeable with other Juki lines. Comes standard with a new axes control system, which means more motors on the pick-and-place head but fewer cables. Conforms to RoHS.

Juki Corporation, jas-smt.com

Mentor Graphics released of the latest version of its Board Station design flow for large, enterprise customers. The Board Station flow includes tools for design creation, layout and manufacture, and is for enterprise design teams.

The release offers improved integration with the enterprise, as well as improved design productivity and 'what if' signal integrity analysis. New feature include:

Library and data management -- Tighter integration with DMS and added functionality to provide off-the-shelf RoHS design-for-compliance capabilities.
Constraint editor system -- Addition of electrical rules entry, layout and analysis functionality to complement the high-speed physical rules already provided.
Signal integrity verification -- Addition of the newly released ICX Pro Explorer functionality to the flow, Mentor's high-speed constraint development tool.
Design layout -- Significant productivity enhancement capabilities including additional support for layout of flex boards; trace glossing so designers can more closely control interactive routing on dense designs; hard and soft autorouting "fences" to help control routing around dense BGAs as opposed to through them resulting in higher routing completion rates; additional gate and pin swapping capabilities to optimize layout.
FPGA-on-Board -- Improved integration of I/O Designer to accommodate high pin count, high performance FPGA implementation.

Mentor Graphics, mentor.com

Practical Components, the supplier of dummy components, has added Amkor Technology's PoP (PSvfBGA), a stackable very thin fine-pitch BGA package.

Also new is Amkor's tsMLF (Thin Substrate Micro LeadFrame-TAPP), a sub-100 micron flip chip test die, and the redesigned Cookson, Indium and AIM print test boards and kits.

Also new is Amkor's CVBGA very thin ChipArray BGA.

practicalcomponents.com