Products
The S3088-II high-speed AOI system includes Viscom 8M sensor technology and an EasyPro3D user interface. Offers inspection of assemblies on PCBs up to 450 x 350 mm. On-demand high-res enables a resolution of 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis. Can inspect components as small as 01005. Offers color evaluation as standard. Operator interface comes with automatic parameter optimization and a comprehensive LIB2007 inspection library. Library contains more than 1,600 component types.
Viscom Inc., www.viscom.com
EZReball solder ball preform is said to simplify the reballing process. Permits reliable replacement of solder balls on a BGA device. Alignment is reportedly simple with the edges being “squared up” with the sides of the package; is said to eliminate the need for custom frames or fixtures. Adhesive holds balls firmly in place until after reflow. After reflow, the stencil is peeled off. Comes in packages of 15. Stencils are custom made, including SnPb and Pb-free alloys.
BEST Inc., www.solder.net
EnviroMark 923 is a halogen-free, Pb-free and no-clean paste. Is said to have excellent wetting, low voiding and soft pin probeable residues. Reportedly has consistent solder paste volume deposits regardless of idle time, stencil life and print speed. Offers 0201 print and reflow capabilities with standard Type 3 powder. Capable up to 200 mm/sec print speed and bridge resistant.
Kester Inc., www.kester.com
Press Releases
- RBB Welcomes Shawn Myers as Engineering Project Manager
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- Incap Slovakia invests in cleanroom capability to support semiconductor manufacturing requirements
- Orbit Technologies accelerates growth and doubles production capacity with Europlacer iineo placement machine