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Products

MC683 is a four-head dual gantry pick-and-place system. Includes Cognex on-the-fly vision alignment, for 0201s, SOICs and µBGAs, while bottom vision handles 0.015" pitch QFPs and large BGAs. A plug-and-play feeder docking trolley can be configured and loaded off-line. Is configured with two pairs of heads that work independently on each gantry. The ball screw driven system has DC-servo motors and closed-loop, non-contact linear encoding for ±0.01mm X-Y repeatability. An automatic 3-stage conveyor contributes mounting speeds of up to 10,500 cph.

Manncorp, www.manncorp.com

MFR-2200 Series is for production hand soldering, touchup and SMD rework. Incorporates SmartHeat technology and the ability to operate different handpieces simultaneously. Includes a range of soldering and rework cartridges, similar to Metcal, and tips, including a cartridge handpiece with a variety of fine access and SMD rework tips, a high-power soldering tip handpiece designed for volume production environments, and a precision tweezer handpiece capable of removing a range of components from 0201 chips to 28mm SOICs.

OK International, www.okinternational.com

Hysol FF6000 reflow-cured encapsulant material combines flux functionality and underfill protection. Is formulated to provide flux for Pb-free solder joint formation. When cured, reportedly delivers protection against mechanical stress. Bottom-side spheres are dipped prior to component placement; device is placed onto PCB or substrate, and then travels through reflow. Flux provides action necessary for solder joint formation, and the epoxy encapsulates each solder sphere. Is said to eliminate the need for dispensing equipment and the time required for underfill application and cure. Is suited for package-on-package device configurations and large BGAs and CSPs.

Henkel, www.henkel.com/electronics