A series of nine turnkey lines are targeted to diverse production and budget demands. Each include a pick-and-place machine, stencil printer and Pb-free reflow oven, with conveyors and board-handling equipment available. Lines include high-mix, mid to high-speed, as well as low-volume starter and lab.
The SV-100 Slider Valve for solder paste dispensing is said to be up to 20% faster than standard auger dispensers; reportedly achieves 20,000 dots per hr. (on 1 mm grid) while delivering dots of less than 300 µm (0.012") for solder paste types 4, 5 and 6. Dots as small as 125 µm (0.005") in diameter can be achieved with type 6 paste. Dispenses dots and lines of pastes and fluids that contain metal additives with minimal clogging. Is compatible with Pb-free and no-clean solder pastes and silver-filled epoxies. Is for solder paste dots for passive components smaller than 0603, rework of BGA and QFN electrical connections, lines and patterns for RF shield attach, low-volume/high-mix applications, and unique patterns of conductive epoxy.
Loctite 5210 is a fast-cure thixotropic silicone material said to be ideal for devices in harsh environments. Offers alternative to hot-melt glues. Is a non-corrosive room temperature vulcanization silicone material designed for wire tacking, selective sealing, vibration dampening, and rework/repair applications. Reportedly has dispense times as little as 31 sec. for two connectors and a tack free time of fewer than 5 min. Offers a high UPH alternative. Material reportedly will hold its form and will not spread or migrate to other locations. Cures at room temperature.