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The LTS200 Lead Tinning System is a programmable, automated machine that reconditions component leads for hi-rel and/or RoHS applications. Can be used for conventional lead tinning or for re-conditioning SnPb parts. Built using designs and components from KISS Selective Soldering systems, including the KISS-ware OS. Has a central fluxing station with two solder pots. Can be programmed to handle transistors, capacitors, diodes, axials, radials, QFPs, pin grid array, sips, dips and connectors.

ACE Production Technologies, www.ace-protech.com

A series of nine turnkey lines are targeted to diverse production and budget demands. Each include a pick-and-place machine, stencil printer and Pb-free reflow oven, with conveyors and board-handling equipment available. Lines include high-mix, mid to high-speed, as well as low-volume starter and lab.

Manncorp, www.manncorp.com/turnkey
 
 
The SV-100 Slider Valve for solder paste dispensing is said to be up to 20% faster than standard auger dispensers; reportedly achieves 20,000 dots per hr. (on 1 mm grid) while delivering dots of less than 300 µm (0.012") for solder paste types 4, 5 and 6.  Dots as small as 125 µm (0.005") in diameter can be achieved with type 6 paste. Dispenses dots and lines of pastes and fluids that contain metal additives with minimal clogging. Is compatible with Pb-free and no-clean solder pastes and silver-filled epoxies. Is for solder paste dots for passive components smaller than 0603, rework of BGA and QFN electrical connections, lines and patterns for RF shield attach, low-volume/high-mix applications, and unique patterns of conductive epoxy.
 
Asymtek, www.asymtek.com
 

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