Products
Wafer-Vac general-purpose wafer vacuum handling tool comes with 8" molded wafer tip (WV-9000-MW8). Handles wafers, solar cells and other substrates. Diaphragm vacuum pump generates up to 10" of mercury with an open air flow of 2.3 lpm. Connects to ground automatically with a three-wire power cord. Class 100 Cleanroom safe. Comes standard with long-life pump and push-button wafer tip pen: VWP-500-2.5mm. Has a footprint of 7¼" x 3" x 2½" and comes with 6' of clear coiled vacuum hose. Plugs directly into 110V 50/60 Hz.
Virtual Industries, www.virtual-ii.com
Rapido RPS3000-S32XL provides an increased surface for multi-board panels up to 500 x 500 mm. Is based on Scanflex with short wire interface for up to 32 sites; supports double-sided probing for up to 3,000 nails. Developed for in-system programming of non-volatile memories such as Flash, MCU and PLD. Allows a combination of programming tasks with test strategies such as boundary scan, processor emulation, chip embedded instruments or functional test; can be executed in parallel on 32 boards integrated into one panel.
Goepel electronic, www.goepelusa.com
NC722 low-melting SnBi solder paste is halide-free and rosin-based. For use with low-temperature alloys such as Sn42Bi58. Reportedly offers good open times, abandon time and soldering activity with all surface finishes. Meets or exceeds ANSI/J-STD -004, -005 requirements, as well as Bellcore test criteria. Features print volume consistency with surface area ratios as low as 0.55. Is suitable for high RH areas.
FCT Assembly, www.fctassembly.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment