Products
NXT III component mounter features a faster XY robot, faster tape feeders, and a new "flying vision" parts camera. New H24 head is said to be capable of 35,000 cph per module. Reportedly capable of placement accuracy of +/-25 microns. Can reportedly places parts down to 03015 package styles.
Fuji Machine Mfg., fujiamerica.com
No. 977 is an electrically-heated, 500ºF universal style oven for preheating racks of small circuit boards. Workspace dimensions measure 30" x 40" x 31". 9KW are installed in Nichrome wire heating elements to heat the unit, while a 600 CFM, 0.5-hp recirculating blower motor provides front-to-rear universal airflow to the workload. Features 4" thick insulated walls, Type 304, 2B finish stainless steel interior and aluminized steel exterior. Is equipped with four drawers, each 24" x 30" x 2" and rated for 50 lb. loading. Drawers open to extend 20" from front of oven. Integral leg stand provided. Controls include digital indicating temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch.
The Grieve Corp., www.grievecorp.com
MPM EnclosedFlow print head now features positive-displacement, motor-driven pressure system that controls paste chamber pressures to within +/- 0.1 psi. Prints fine features such as 01005s and 0.3mm pitch CSPs with reportedly up to 50% greater volume and 25% lower deviation than squeegee blades. Is good for high-volume fills such as paste-in-hole. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke. Is a "plug-and-print" solution. Is for high product mix environments; has detachable, modular chambers that can be removed and stored with fewer than 5 min. needed for changeover. Comes on Accela and new printers; supported sizes include 8", 10", 12", 14", 16", and 18".
Speedline Technologies, www.speedlinetech.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment