Products
Siplace Di-Series placement machines include digital vision systems, single and dual conveyors and multi-language station software. Available with one, two and four gantries. Siplace D1i, Siplace D2i and Siplace D4i place components down to 01005s. Include S-feeders. Component cameras have high-resolution; changeover tables are newly developed. Can accommodate three flexible head types: the 12-nozzle collect and place head, the 6-nozzle collect and place head, and the TwinHead.
ASM Assembly Systems, www.siplace.com
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for temperature-sensitive components, shorter reflow cycle times and reduces energy.
Inventec, www.inventec.dehon.com
Scorpion high-speed jetter has piezo jetting valves that enable jetting with speeds of up to 800Hz. Fluid box is less than 150nl. No tubing to connect fluid to jet valve. Can be equipped with up to four valves or pumps, including jet valves, Archimedian screw valves, time pressure valves and slider valves. eDIS software offers context-sensitive help; CAD import is supported. Includes library of best known parameters for common fluids.
Essemtec, www.essemtec.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment