Products
Capital Harness TVM software automatically generates electrical system and wire harness manufacturing process and cost data specific to each harness design, factory and company’s cost models. Supports process choice and sourcing decisions. Is able to act directly on design data generated by other tools from the Capital suite, and can be implemented as part of an extended flow or standalone. Reads data in several standard formats, including KBL. Data can be received from a variety of industry tools.
Mentor Graphics, www.mentor.com
topoView is part of XI-Pilot v. 3.1 x-ray inspection software for evaluation of x-ray images. Facilitates interpretation of x-ray images with respect to better fault assessment and classification. Construes every grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed on a higher position than less thick PCB materials (light grey values). Faults such as lifted leads, shorts, non-soldering, insufficient or too much solder are displayed.
Goepel electronic, www.goepel.com
Asscon VP1000 and VP6000 vapor phase reflow systems now come with Dynamic Profiling, which automatically adjusts and controls reflow profiles. Simplifies setup and preparation of reflow profiles; eliminates interferences due to different loads or usage conditions. User determines temperature profile and keys in values to the PLC user interface. Can create soldering program by determining start soak temperature (°C), duration ramp, and time above liquidus. Uses embedded three temp. reference measuring points for permanent control and monitoring of the profile. Controller can use temp. behavior of selected reference measuring points to start appropriate control actions during profiling.
Asscon Systemtechnik, www.asscon.de
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment