Products
Boundary scan platform expansion enables functional testing of automotive serial bus systems, including CAN-FD and LIN, during production. The Bus Access Cable (BAC) module integrates with the Scanflex Multi Port Bus I/O Module 9305, providing direct access to automotive interfaces through the Scanflex system. The module supports simultaneous vector generation and control sequence distribution via the Scanflex boundary scan controller, enabling synchronized testing across multiple interfaces. Designed for automotive electronics applications, it facilitates validation of communication systems increasingly reliant on combined CAN-FD and LIN architectures.
Chip mounters support high-speed SMT assembly with placement rates up to 95,000 components per hour. The systems reduce board recognition time by approximately 30% and use vision-based alignment and calibration to improve placement accuracy and minimize component loss. They handle a wide range of components and support PCB weights up to 4.5kg. The platforms include updated user interfaces and are designed for integration with smart factory environments and automated material handling systems.
Slot-die coater supports thin-film deposition on rigid substrates and flexible materials for research and development applications. The system integrates a vacuum chuck, syringe pump, and heating for controlled coating and drying in a single unit. It enables film thickness control from nanometer to micrometer scale and supports slot-die, bar, knife, and flexo coating methods. The platform is available in two sizes and can be configured for roll-to-roll processing. It is designed for use in laboratory environments including gloveboxes and fume hoods.
