Products
Hirose's BK11 Series multi-power hybrid FPC-to-board connector delivers a footprint up to 46% smaller than conventional designs. Supporting two main power contacts at 4A per pin, four sub-power contacts at 2.5A per pin and 10 signal contacts.
YINCAE's TM 150LM is a Liquid Metal Thermal Interface Material (TIM). Delivers improved printability, thermal stability and reliability in high-power electronics.
ViTrox launched three Smart 3D AOI platforms – V510Ai DST, V510Ai ST and V510Ai R – designed to advance back-end PCB assembly inspection through dual-sided, AI-powered and robotic vision technology.
Press Releases
- SEHO North America to Host Academy Training in Cincinnati in October
- vAI from Viscom – Enhancing Performance with Artificial Intelligence at productronica India 2025
- Scanfil ranks in the top five percent of companies in EcoVadis sustainability assessment
- ECIA Executive Conference Committee Finalizes Program for “Amped Up, the Power of Tomorrow”