Products
Boardera API PCB project analyzer automates fabrication analysis, BOM processing, assembly planning and project pricing for electronics manufacturing workflows. The system extracts fabrication requirements including layer stackup, board dimensions, copper area, drill data and pad features from design files. BOM tools map component data, generate procurement links, assess availability and end-of-life risk and flag compliance with RoHS and REACH. Assembly planning functions calculate part counts, placement volumes, and package classifications to support process planning. Pricing modules support PCB-only, assembly-only, and turnkey configurations with models aligned to fabrication and EMS operations. The API integrates into manufacturer systems to support design analysis, quoting and production planning across PCB fabricators, assemblers and OEMs.
Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.
Print Param Decision Assist software tool evaluates PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction (NPI). The tool analyzes board dimensions, component types, solder-paste type, stencil thickness and aperture geometry to calculate settings including system pressure, printing speed, squeegee angle and stencil cleaning frequency. Integrated into the latest release of YSUP-PG, the programming environment within Yamaha’s YSUP intelligent factory software suite. A graphical interface allows operators to review recommended parameters and adjust settings before production. Intended to support faster NPI setup and parameter verification during stencil printing processes.
Press Releases
- ASE CEO Tien Wu to Keynote IEEE ECTC 2026 in Orlando
- Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc. a subsidiary of Blackstone Global, Across the United States and Canada
- MicroCare Appoints Uwe Wanner as Director of Research & Development
- Global Tablet Shipments Decline 3% QoQ in Q4 2025 as Market Matures