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Dymax has introduced 9773, a ruggedizing and staking adhesive engineered to secure and protect components on printed circuit boards used in satellites, missiles and other space-based systems. The material is certified to NASA ASTM E595 Low Outgassing and Mil-Std 883 Method 5011 Low Ionic Content standards. Offers on-demand UV/visible light curing, which speeds processing and increases throughput by eliminating delays associated with traditional two-part epoxies. It is non-slumping for up to 72 hours on vertical surfaces and is compatible with jet dispensing, making it well-suited for ruggedizing, staking, or encapsulating PCB components. With a one-part, solvent-free and halogen-free formulation, Dymax 9773 also supports sustainability goals while delivering high performance.

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Yamaha Robotics has introduced its latest LM placement head, engineered to extend the capabilities of surface-mount machines to handle today’s larger, heavier, and more complex components. The LM head combines enhanced hardware and software features, including extended R-axis and Z-axis control, high-precision placement-force management up to 100N and advanced landing detection, to support accurate alignment and insertion of bulky components such as high pin-count press-fit connectors. A redesigned gripping section and a new suite of interchangeable nozzles allow secure handling of oversized ICs, DIMM sockets and other non-standard parts, while compatibility with existing nozzles ensures seamless placement of standard SMD, SOP, and QFP devices.

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ioTech has unveiled the io600, a high-speed, high-resolution inline digital laser material deposition system engineered to bring Continuous Laser Assisted Deposition (CLAD) into full-scale industrial manufacturing. Capable of depositing up to 7.2 million dots per hour with a 600 x 600 mm active work area, the io600 delivers 50µm resolution and ±10µm positional accuracy for high-volume production. Its nozzle-free, non-contact laser design eliminates clogging and maintenance, enabling continuous operation and lower ownership costs. Supporting a wide range of dielectric and conductive materials, including polymers, solder pastes, conductive inks, metals and ceramics, the io600 enables complex multilayer geometries and seamless scaling from prototyping to mass production. 

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