TAIPEI, TAIWAN – Global AI server shipments are forecast to grow more than 28% year over year in 2026, driven by continued investment from N... Read More...
WALTHAM, MA – Nano Dimension reported preliminary, unaudited fourth quarter 2025 revenue of $35.0 million to $35.5 million, exceeding its pr... Read More...
PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) today named Andy Shaughnessy its first content architect. Read More...
TAIPEI – Inventec said it will invest approximately $136 million to expand production capacity at its Thailand operations, reflecting accele... Read More...
WASHINGTON, DC – Following yesterday's White House announcement regarding Section 232 presidential proclamations affecting semiconductors an... Read More...
TAIPEI, TAIWAN – Foxconn Interconnect Technology Limited (FIT), an affiliate of Taiwanese electronics manufacturer Foxconn, has agreed to ac... Read More...
LONDON, UK – Global PC shipments rebounded in 2025, but tightening memory and storage supply is expected to weigh on growth this year, accor... Read More...
PLANO, TEXAS – Siemens has acquired Aster Technologies, a specialist in printed circuit board assembly (PCBA) test verification and engineer... Read More...
PEACHTREE CITY, GA – January 12, 2026 – The exhibition hall floor space for PCB East (http://www.PCBEast.com) 2026 is more than 90% sold out... Read More...
How do modern stencil materials and coatings influence transfer efficiency and volume repeatability as SMT features continue to shrink? The key indicators of S... Read More...
Where excess inventory stops being clutter and starts being currency. For years, companies have treated excess electronic components like an embarrassing secre... Read More...
Treating technology as a human replacement strategy is a recipe for failure. Here’s the questions you should be asking. I have good news: Your board just appro... Read More...
Innovation gets applause, manufacturing gets contracts. We’re almost out of time. That is the message underlying US Department of War Secretary Peter Hegseth’s... Read More...
Just when the industry thought the shortage saga was over, the parts giant hit refresh on the chaos. The global electronics industry faces another shortage sit... Read More...
The real bottleneck isn’t the layout; it’s decoding those half-hidden specs stuffed into a PDF. Every electronics engineer and PCB designer knows the feeling: ... Read More...
How a longtime PCB supplier became a contract manufacturer. More than a handful of US-based printed circuit board fabricators offer some degree of assembly in ... Read More...
Nine critical checks for OEMs to avoiding bottlenecks. Established OEMs with ambitious growth goals often hit a wall as they expand their product ranges. Inter... Read More...
Somewhere between the badge scanner beep and missing business cards, community happens. I’ve been reading to my son before bed lately. And now that we’ve (merc... Read More...
The Gen 2 TMBS rectifier module series consists of 100V trench MOS barrier Schottky devices designed for industrial power conversion applications. Offered in a ... Read More...
ElectronicsGPT is an AI agent designed for electronics procurement workflows, providing access to technical specifications, part alternatives, availability data... Read More...
The RNAN series is a thin film precision chip resistor line built on an aluminum nitride substrate to support higher power dissipation. Uses a high-thermal-cond... Read More...
The F40/F40s is a Full HD digital microscope system designed for configurable, high-resolution optical inspection using an upgraded image sensor and a motorized... Read More...
EP54TC is a two-component, electrically insulating epoxy designed for heat sink bonding and thermal management applications requiring high thermal conductivity.... Read More...
RMCA automotive-grade thick film chip resistors from Stackpole are surface-mount components qualified to AEC-Q200 for use in automotive electronic applications.... Read More...
The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one pla... Read More...
The TR7600FB SII is a 3D automated X-ray inspection system. Optimized for specialized substrates, fine-pitch BGAs, multilayer boards and system-in-package (SiP)... Read More...
PF606-P266J is a solder paste developed for high-speed jet dispensing applications in advanced electronics manufacturing. Designed for non-contact solder deposi... Read More...