Circuits Assembly Online Magazine - Sasinno to Showcase Innovative Selective Soldering Solutions at productronica 2023

NEWS

Global Semiconductor Manufacturing Industry Improves in Q1, SEMI Reports

MILPITAS, CA – The global semiconductor manufacturing industry showed signs of improvement in the first quarter with an uptick in electronic... Read More...

Lacroix Reports 4% Q1 Revenue Decline

SAINT HERBLAIN, FRANCE – Lacroix posted revenue of €186.3 million ($201.5 million) for the first quarter, down 4.4% compared with 2023's fir... Read More...

SVI Public Co. Sees 18% Decline in Q1 Revenue

PATHUMTANI, THAILAND – SVI Public Co. announced revenue of THB5.1 billion ($142.4 million) for the first quarter, a decrease of 17.6% from l... Read More...

Foxconn Reports Sharp Rise in Q1 Profits

TAIPEI – Foxconn reported a 72% rise in first-quarter profit, its third consecutive increase in quarterly profit. Read More...

Aurelius Breaks Ground on New Malaysian Plant

KULIM, MALAYSIA – Aurelius Technologies has begun construction of a new manufacturing plant in Kulim Hi-Tech Park. Read More...

Tech Visionary Harold Moss to Keynote PCB East 2024

PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) today announced technology visionary Harold Moss will keynote the up... Read More...

Syrma Reports 54% Annual Revenue Increase

CHENNAI, INDIA – Syrma SGS Technology reported INR32.1 billion ($384.5 million) in revenue for its full fiscal year, up 53.6% compared to th... Read More...

Foxconn Reaffirms WI Commitment

RACINE, WI – Foxconn stressed its commitment to its Wisconsin operations after Microsoft broke ground on a $3.3 billion data center on a sit... Read More...

Report: Advanced Packaging to Return to Growth in 2024

AUSTIN, TX – Smartphone and PC shipments will each show growth of around ~2% this year, driving small unit shipment growth in all package ca... Read More...

FEATURES

Performance Comparison of Contemporary Stencil Coatings and Underwipe Solvents on 0.4mm BGA Packages

Should chemistry formulation and drying time factor into solvent selection? The practice of periodically wiping excess solder paste off the side of the stencil... Read More...

Investigating Intermittent Soldering Defects

Resolving solder issues requires an examination of the entire process. The PCB assembly process creates millions of solder joints with great precision, which i... Read More...

Preserving Solder Paste Integrity

A closer look at mixing methods and automated mixers. While automation in manufacturing brings efficiency and consistency, the use of automated solder paste mi... Read More...

Exploring the Impact of AI

A special panel discusses the growth of AI tools and its possible effects on the industry. “Will AI take my job?” That’s the question on the mind of many arou... Read More...

Can Artificial Intelligence Solve Manufacturing Problems?

Why Andrew Scheuermann thinks AI will be the assistant every engineer has needed. We in electronics design and manufacturing know automation is part and parcel... Read More...

Low-Temperature Solder: Challenges, Opportunities and Considerations

An exploration of the factors affecting the development and growth of low-temperature soldering. Low-temperature soldering (LTS) is a rapidly developing field ... Read More...

Optimized Materials to Deliver Ruggedized Electronics

A showcase of testing methods used in the development of robust materials. Ruggedization means “to strengthen (something, such as a machine) for better resista... Read More...

Windy City Tour

Chicago’s EMS companies place an emphasis on responsiveness. While major manufacturing centers in Mexico, plus the more than 250 EMS companies in the Silicon V... Read More...

High-Density Interconnect Technology: An Overview

Design and manufacturing considerations for HDI PCBs. High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics ind... Read More...