DE-7826 (dam) and CE-7826 (fill) dam and fill chip encapsulants are for chip-on-board applications. Are designed to protect wire bonds and reduce stresses associated with thermal cycling. Are engineered to withstand circuit board reliability test criteria. Have thermal expansion coefficients in the 20ppm range when measured by thermal mechanical analysis. Have high glass transition temperatures and modulus to retain low expansion properties throughout operating temperature range of the circuit board. Meet standards for ionic cleanliness.

Engineered Material Systems, www.conductives.com

LF-Z3 PF-14 D3 is a SnZn paste designed for reducing Ag-erosion such as silver pad. Has peak reflow temperature of approximately 225°C. Has high reactivity; flux medium with activation control is required. Is designed to maintain a stable viscosity during storage to preventing any degradation of paste. Is halogen-free.

Nihon Superior, www.nihonsuperior.co.jp/english

SN100C7A is a high melting point Pb-free solder alloy. Is an extension of SN100C; provides benefits of nickel-modified microstructure with minimal growth of interfacial intermetallic. Can be applied to assembly of power modules that require a high melting point alloy.

Nihon Superior, www.nihonsuperior.co.jp/english

SN100C P810 D4 is designed for use in vacuum reflow with nitrogen. Is a high-reliability no-clean Pb-free solder paste optimized to deliver excellent reflow characteristics; generally can be reflowed with a profile similar to that commonly used with SAC 305 and SAC 405 with 240°C peak. Reduces voiding to less than 1% in measured void area. Has excellent wetting behavior. Is a compliant alloy that provides high-impact strength.

Nihon Superior, www.nihonsuperior.co.jp/english

FX SL AOI inspection system reportedly has more than twice the inspection speed of previous generation systems. Magnification options include 8, 12, and 25 µm/pixel. Delivers automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is well suited for high-volume and high-mix manufacturing environments; is capable of inspecting 01005 components. Uses a standard package library.

Nordson YESTech, http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx

ProDEK dynamic print process control is said to enable real-time continuous alignment adjustments and cleaning frequency adaptation to enhance throughput and yield and limit operator intervention. Uses paste offset (alignment) data feeds from the SPI to monitor a configurable quantity of PCBs, sending an independently corrected forward and reverse offset to the printer, which then adjusts paste on pad alignment in real-time. Using barcode tracking technology, guarantees printed and inspected board synchronization. Monitors high area warning counts from SPI data feeds, as potential indicators of excessive or insufficient understencil cleaning. Automatically adapts cleaning frequency to suit current process conditions, optimizing understencil cleaning and introducing more stability while significantly reducing consumables usage. Retrofittable to DEK printers, and compatible with CyberOptics, Koh Young and Parmi SPI.

DEK, www.dek.com

YSM40 high-density modular surface mounter adopts a 4-beam, 4-head layout on a compact platform with a width of 1m. Has a mounting speed of more than 100,000 cph. Is for small- to mid-sized printed circuit boards. Has 4- or 2-beam layouts, three types of heads, and a dual-lane conveyor layout. Includes automatic tray supply carriage and electric-powered ZS Feeder with a non-stop insertion/extraction function.

Yamaha Motor Co. Ltd., http://www.yamaha-motor.co.jp

FLXHD automated duplication system for e-MMC devices uses 40 sockets in parallel for a throughput of over 700 parts per hour. Has a simplified touchscreen and intuitive graphical user interface. Has no changeover time associated with downloading large files when switching from one job to another. Has a desktop footprint.

Data I/O, www.dataio.com/FLXHD

Hydron WS 325 cleaning agent is for water-soluble defluxing spray-in-air inline and batch cleaning applications. Can be applied at low concentrations (3% to 5%). Penetrates capillary spaces underneath low standoff components where DI-water-only applications can no longer provide reliable cleanliness levels. Is a mild formulation gentle on sensitive materials and solder joints.

Zestron, www.zestron.com

Wincon 5.0 control system software is used in conjunction with Intellimax control board on all BTU systems, including Pyramax convection reflow ovens. Has Windows 7 compatibility, dual process capabilities, maintenance manager and OPC functions. Dual process capabilities permit speed and rail set point changes on one lane while the other lane continues to process product. Equipment maintenance reminders are provided through the maintenance manager function, providing customers a default maintenance plan or allowing them to use their own. The OPC function is an alternative to GEM Host and provides a way for customers to extract data from the system using OPC clients. 

BTU International, www.btu.com

HALT (Highly Accelerated Life Tests) and HASS (Highly Accelerated Stress Screens) test chambers feature EZT-570i touch screen controller. EZT-570i replaces Watlow F4 programmable controller as standard. Reportedly makes chamber easier to operate and monitor. Includes data logging, remote control and monitoring, email/text alarm notification messages, data file backup system, full system security, and pre-programmed test profiles. Chambers also include CSZ EZ-View software; works in conjunction with EZT-570i controller. Time Compressor Chambers are used to detect flaws in design. Are available in four sizes: TC-1.5, TC-2.0, TC-2.5, and TC-4.0. Temperature ramp rates are up to ±100ºC/min with random vibration levels <3.0 to 90 GRMS. 

Cincinnati Sub-Zero, www.cszindustrial.com 

DA-5045-2 and DA-5045-4 die attach adhesives for attaching light-emitting diodes (LEDs) and small die are thermally and electrically conductive. Withstand JEDEC level 1/ 260°C reliability standards in LED packaging applications. Have thermal conductivities >20 W/mK when measured by laser flash. Feature high glass transition temperatures (Tg) and modulus to enable wire bonding, and are electrically conductive for static drain.

Engineered Materials Systems, www.conductives.com