DataMan 300 fixed-mount industrial ID reader increases barcode read rates with a 1DMax+ algorithm. Incorporates Hotbars technology, which uses texture to locate barcodes at any orientation, and then extracts high-resolution 1-D signals for decoding. For 2-D matrix and difficult-to-read direct part mark codes, reading has been improved with an upgraded algorithm. Offers enhancements in handling damaged codes at high line rates and poorly marked or extremely damaged codes. Model 300 provides standard resolution (800 x 600 pixels); model 302 (1280 x 1024 pixels) is for reading small DPM codes on small components.

Cognex, www.cognex.com/300

C series of high thermal efficiency soldering cartridge models include C105 cartridges for the NP105 and NT105 Nano Handpiece and tweezers, C245 Special Cartridges for the T245 Handpiece, C360 Tips for the Micro-desoldering Iron and C470 Special Cartridges for the T470 Heavy Duty Handpiece.

JBC Tools, www.jbctools.com

 

PCBRM100 benchtop rework station has top- and bottom-focused convective heating said to virtually eliminate copper dissolution on plated through-hole components on high thermal mass assemblies. Solder contact time is reportedly almost instantaneous before a component is removed or replaced. Features include 24” x 24” board carrier, programmable x,y,z axes, 28” x 28” top and bottom preheater, barrel cleaning system and 90 lb. pot with stable, thermally balanced wave.

Air-Vac Engineering, www.air-vac-eng.com

Reflow Process Index is designed to provide maximum quality and throughput from SMT reflow ovens. Helps manage reflow ovens to consistently maximize desired results. Provides process deficiency information to help correct defect issues quickly. Is an automatic system that, once programmed, works in the background without operator involvement. Shares all pertinent process and production data in real-time; automatically profiles every PCB; provides instant alarm for out-of-spec situations; automatic SPC charting, including Cpk; process traceability down to individual PCBs; prevents human error, such as production of the wrong PCBs or wrong oven recipe settings (barcode required).

KIC, www.kicthermal.com

PrinTEK I series benchtop SMT printers feature a synchronized 4-cam liftoff system, magnetic array table with locking pin-plates to easily tool the printed circuit board position, and rugged and accurate 3D via precision x, y, and theta anti-backlash adjustment heads. Basic printer handles PCBs up to 18" x 18"; large versions handle 18" x 24", and 24" x 36" boards.  Optional patented dual squeegee gantry head and dual video microscope alignment system.   

Transition Automation, www.transitionautomation.com 

Sigma G5 is a compact, modular mounter available in high-speed and flexible high-speed configurations. Can accommodate board sizes of 510 x 610mm up to 460 x 820mm. Includes a two-head placement system; two quick-change feeder bases that accommodate tape and stick feeders or quick change tray unit with tape feeders, and an Overdrive Control System whereby both heads can pick from each other’s component supply and place on the same board simultaneously. Has EG-100 offline library creation table-top system, NT-100 offline programming station, LISA traceability station, and offline changeover station.

Hitachi High Technologies America – Production Systems Division, www.hitachi-hta.com

PVA selective coating platforms now come with conformal coating inspection. Provides UV inspection capability to check for coated and uncoated areas of a printed circuit board. Camera option combines selective coating and automated UV spot inspection within the same machine; can detect presence and/or absence of coating and helps ensure coating is not in "keep out" zones. Locations to inspect are fully programmable. A high-power UV ring light is included for coating illumination; is for use with coatings that fluoresce under UV black light.

PVA, www.pva.net

Solder Paste Recycling unit reportedly is able to reduce the amount of waste material to less than 10% of current volumes. Now enables the separation of flux and solder, using a solder pot mechanism that inverts during each cycle. Turns wasted solder paste into solder bar in approx. 34 to 45 min. Max. volume per cycle is approx. 5.5 lb.

Seika Machinery Inc., www.seikausa.com