TOM Selective-Line module is for selective through-hole solder joint inspection. Combines  modular illumination, telecentric lens and intuitive software for quality, reproducible evaluations of PTH solder joints per IPC-A-610. Is said to be easy to integrate. Can be offline or inline.

GÖPEL electronic, www.goepel.com

Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are resistant to chemicals typically found in PCB manufacturing and remain dimensionally stable at elevated temperatures. Provide excellent electrical properties, including dielectric strength, which provide excellent electrical insulation and isolation. Are offered in 0.001" and 0.002" thicknesses. Constructions are available with high-temperature acrylic or ultra-high temperature silicone adhesives. Double-coated high-temperature versions (XT-636 and XT-654) are designed to withstand temperatures up to 500°C. ESD versions (XT-652 and XT-653) are ideal for bonding static sensitive devices to a variety of substrates. Provide both low peel voltage (<100v) when the liners are removed and again when the bonded part is removed. Flame-retardant tape (XT-657) provides high-temperature resistance, as well as helps prevent the propagation of fire. Is halogen-free and tested for compliance with the UL94 VTM0 and FAR 25.853 flammability and BSS 7238/7239 smoke and toxicity standards.

Polyonics, www.polyonics.com

In-Sight 500 industrial vision system can inspect parts on high-speed production lines. Is a fixed‐mount vision system packaged in IP65‐rated housing. Is powered by Cognex VSoC; processes images at up to 500 frames per sec. with windowed acquisition. Achieves speeds of 100fps at 1024 x 768 pixels of resolution and 200fps at 640 x 480. Can acquire images while simultaneously processing applications at 500fps.

Cognex Corp., www.cognex.com  

Model LH115 Hand Glo-Ring infrared heat tool is for heat shrinking, plastic tube bending, soldering, adhesive curing, solder preforms, butt welding and more. Incorporates quartz-encapsulated heating elements that open and close to encircle work pieces with instant radiant heat at adjustable temperatures up to 1500°F (815°C). Reportedly generates no RF interference. Suitable for clean rooms and testing areas. Is said to use less electrical energy than a heat gun, does not blow hot air, is quiet and simple to maintain.

Eraser Co., www.eraser.com

KIC 24/7 Wave uses embedded sensors in the wave solder machine to automatically measure thermal profiles for each and every processed PCB to the acceptable process window. Thermocouple installed in solder pot constantly measures bath temperature. Identifies out-of-spec conditions. Standard SPC charts automatically provide Cpk numbers; alarms indicate process drift. Records every PCB profile for full process traceability. Quickly identifies appropriate wave solder settings. 

KIC, www.kicthermal.com

Divisio 6000 Speed depaneling system has a modular design for depaneling and feeding. Supplements follow-up process' functional areas with new, additional functional area to enable simple adaptation to speed or process applications. Integrates different final assembly processes for process applications. Uses product carrier circulation system or shuttle to balance between feed-in and feed-out and to buffer circuit board and tray change times as well as short-term malfunctions. Decoupling of feed-in and feed-out is said to reduce auxiliary process times. Cycle times of under 3.5 sec.; under 1 sec. with multi grabbers.

ASYS Group, www.asys-group.com

Vego series of handling systems has an updated user interface with color touchscreens. Are said to seamlessly integrate with ASYS process machines to form offline “island” configurations or entire production lines.

ASYS Group, www.asys-group.com

2800ISP in-system programming station incorporates 8th generation site technology using Vector Engine BitBlast. Can program flash architectures, including eMMC, PCM and Raw NAND, plus microcontrollers and other device technologies on-board after reflow. Reportedly ideal for medium- to high-volume production; is configurable and can program up to 16 devices in parallel. High-density flash memory devices are able to achieve read/write speeds up to 140 Mbits per sec.

BPM Microsystems, www.bpmmicro.com

XACT 4 flexible screen and stencil printer handles large boards. Features dual light source vision, patented 2-1/2D post-print inspection, and standard closed-loop controlled print head, expanded substrate size capability. Is compatible with IPAG Integrated Paste and Glue Dispensing

ASYS Group, www.asys-group.com

ezLOAD PCB support system includes an active grip technology to hold boards during the assembly process. Protects components, while boards are able to move freely through the assembly line. Requires no air, electronics or communication from the user. Magnetic locking base enables quick installation. Other base designs are available for nonmagnetic tables. Standard designs are available for Panasonic CM88C-M, CM86C-M2, MSR; Yamaha YV100II – YV100X; Samsung CP60, CP40LV, CP45FV, CP45NEO; and Fuji NXT and XP-142. Is customizable depending on machine requirements, specialized components or specific design application requirements.

Count On Tools, www.cotinc.com/ezload

AI-674 PCB conformal coating and curing system controls temperature and viscosity with a circulated pump unit. Is compact. Features combined drying (curing) unit, dual-side coating, tilt, double-head, jet-dispensing and masking. Optional automatic changeover and width change and QR code reader.

A-I-TEC, www.a-i-tec.co.jp

Seika Machinery, www.seikausa.com.

Metcal Scorpion rework system permits simultaneous viewing of printed circuit board pads and component pads or balls. Provides accurate component placement and can create specifically tailored reflow profiles through convection heating technology with nozzle and dual-zone pre-heater. SmartPlace Technology vision system employs dual-image overlay technology, providing an image of the solder balls and PCB patterns without the need for prism alignment.

OK International, www.okinternational.com