The Momentum (MPM) printer features CANopen motion control and I/O architecture. Its vision system includes a USB digital camera with look-up/look-down capability, telecentric lens, and advanced lighting techniques. Includes contrast-based 2-D, BridgeVision and StencilVision, all with SpeedVision; new transport and squeegee systems, vacuum stencil wiper and roller solvent bar delivery system. Machine operation with Benchmark software has wizards for error recovery, machine functions and utilities. Reportedly, a new product file can be created in less than 10 min.; any existing process program can be used as template. RemoteTech diagnostics package enables remote support and troubleshooting. Includes a single, front-fixed rail conveyor with top clamp and centernest vacuum hold down and a 17" flat panel display. Board size capability from 609 x 508 mm to 50.8 x 50.8 mm. Accuracy and repeatability is said to be +/-12.5 µm at 6 sigma (Cpk greater than or equal to 2), with a cycle time as fast as 10 sec. (excluding print). 

Speedline Technologies, www.speedlinetech.com

The SP600 automated batch printer comes with a table that can be designed with a standard fixation or a customer-specific substrate holder. Because of shuttle system, any kind of substrate holders reportedly can be used. Enables printing of solder paste onto PCB, conductive glue printing on flex circuits, and special paste application on ceramic on one system. Print table is motorized in four axes (x, y, c and theta); said to allow automatic alignment of the substrate to the stencil. Two vision cameras measure reference structures and calculate offset. Operator can see in real-time which squeegee, stencil or tension frame must be installed. Is said to be ready in less than five minutes for new job. Comes prepared for 29" stencil frames. Substrate holder is designed for single or double-sided PCBs up to 450 x 500 mm. Rubber or metal squeegees with a length of up to 500 mm can be used. Features automatic stencil cleaning (dry, wet, vacuum).

Essemtec, www.essemtec.com

vPlan software will be provided to Spectral Response Inc., enabling faster transition from NPI to full production with a reported seamless coverage for all production lines, including Siemens, Fuji, Universal and Panasonic machines. Will help increase overall equipment effectiveness through process automation. Includes new capabilities, such as auto-generation of machine shapes from VPL. Delivers manufacturing process definitions to the production floor, and automatically generates machine-specific libraries on demand.

Valor Computerized Systems Ltd., www.valor.com        

AutoVue v.19.2 is an EDA-centric product offering that addresses specific requirements of PCB design and contract manufacturing. Is for viewing, reviewing and collaborating on EDA files. Includes native viewing, markup and secure real-time collaboration capabilities via the Web for manufacturing documents, PCB layouts, schematics and Office documents. Electro-Mechanical Professional provides format support for EDA, 3D, 2D and Office document types in a single solution; said to bridge the gap between MCAD and EDA. Delivers enhancements and new format support for manufacturing, A/E/C, oil and gas, and plant design communities, including AutoCAD 2008, SmartSketch 4.0 & 5.0, SolidEdge 19, Inventor 2008 and more.

The SN100C Pb-free alloy flux system is available in low VOC, VOC-free, alcohol-based formulations, solder paste form, and also as paste and liquid fluxes; appropriate for wave, reflow, selective, and hand (cored wire) soldering. Has a synthetic base that reportedly provides stability under the higher temperatures required by Pb-free alloys. Said to work well in air or under a nitrogen blanket. Is compatible with many different finishes, including OSP, Ni/Au, Ag and Sn.

Cobar Solder Products, www.cobar.com

The Traceability and Control Validation Kit is designed to validate manufacturing process and provide the potential for rich product and process traceability detail. Is reportedly the first measurement tool for manufacturers to validate their plants’ traceability and control based on rating traceability. Is designed to help engineers quickly find key products needed to qualify their assembly technology. Is also said to provide the physical materials and procedural guide to determine a factory’s traceability and control capability, and to rate the results in a formalized matrix.

Three semiconductor testing procedures for QFN, DFN, CSP and WLP semiconductor packages use “test on tape“ process, with MCT Tapestry Film Frame Handler. Said to test multiple package types and sizes without requiring mechanical conversion kits. “Test after singulation” process reportedly eliminates semiconductor defects caused by mechanical sawing after electrical testing. The “wafer to pocket die traceability” system is said to track every unit from the wafer through test and inspection to the specific pocket on a reel of taped units; allows customers to perform virtual retest of taped devices in the event of a specification change or new OEM requirement.

Best Electronics and US Export Authority, www.usea.com

Teknek, www.teknek.com