The new Optima 7300 D.1 release includes an enhanced graphical user interface for its Review Pro repair-station software, faster program loading and editing, and support for Windows XP.
 
The repair-station software presents the operator with board-specific failure data taken from the system and collects operator repair data, actions and comments.
 
The new user interface gives technicians easier access to the failing component data and images stored in the repair-station database. By viewing an image of the failing device on-screen, technicians can quickly locate and repair defects.
 
The time to load large inspection programs has reportedly decreased by 70%, improving productivity and throughput.
 
The software will ship with all new Optima 7300 systems starting in March and is available as a free upgrade to customers with a Software Support Agreement.
 
 Landrex Technologies, landrex.com.tw

Flexline electronic component assembly lines are designed for final assembly of components such as power diodes and lead frames for power electronic applications. The assembly line can easily convert to customer specific demands while offering advantages of standardized equipment. This includes an adaptation to modifications in the design during the production as well as the possibility of scaling the line to adapted changes in production volume during its lifetime.
 
According to Claus Lichtenberg, Alphasem's CEO, the Flexline concept expands Alphasem's capability: "So far Alphasem has been located among the top four suppliers for die attach equipment with a reputation in the CMOS sensor assembly and the power device bonding. With our new business concept we successfully entered the adjacent markets of micro systems back-end and electronics component. As a result we can offer the complete solutions from die attach to final assembly of sensors or electronic components."
 
 
Alphasem AG, a Dover Company, alphasem.com

Series 2600 System SourceMeter instruments reportedly combine the highest throughput source-measure unit (SMU) in the industry with a scalable instrument form factor to allow integration into systems from 1 to 16 SMU channels. The single-channel Model 2601 and the dual-channel Model 2602 are modular, scalable instruments for building ATE systems to perform precision DC, pulse, and low-frequency AC source-measure tests.

 

A new embedded Test Script Processor (TSP) lets users program a sequence of test commands and execute high-speed automated test sequences independently of a PC operating system. Features an intuitive intelligence that lets the instrument stand alone as a complete measurement automation solution for component testing. Can control sourcing, measuring, pass/fail decisions, test sequence flow control, component binning and data storage.

 

Equipped with Test Script Builder development software, a simple GUI lets users develop, modify and debug high-speed TSP programs. Each unit also features a built-in suite of pre-written TSP programs that can be modified for specific applications. LabTracer 2.0 software enables easy instrument control, data acquisition and curve tracing in lab or device characterization applications.

 

The high throughput, flexible and scalable instruments are suitable for a range of applications in functional test and R&D environments. Units can perform I-V functional test and I-V characterization of a range of integrated devices and components including discrete and passive devices, and SSI and LSI devices such as ASICs, SOCs, and RFICs. In R&D environments, units can perform device characterization to aid in materials research for device development.

 

Keithley Instruments, keithley.com

Multicore MF210 no clean, halide-free sustained activity flux is formulated to work over a range of solder resists and is compatible with rosin- and OSP-based surface preservatives.
 
Said to offer a maximum process window without resin, which satisfies the demand for applications requiring high performance and reliability. Allows for high-speed soldering on conventional leaded and surface-mount components, good through-hole penetration and optimum wetting of surfaces. 
 
For use in foam, spray or wave fluxes similar to ordinary fluxes on standard wave soldering machines.
 
Meets or exceeds the IPC-TM-650 2.3.32 Copper Mirror Test standard, and meets specifications for J-STD-004 SIR and Bellcore GR-78-CORE electromigration testing.
 
Henkel, loctite.com

Isola Group, SARL has successfully tested IS620 under simulated lead-free assembly conditions. The boards, built at Merix, went through the reflow assembly simulation six times without any delamination. The peak temperatures were over 262°C. The 14-layer capability board was tested before and after eight reflow simulations and the results did not show any thermal degradation, the T-26's were over 60 min. and the decomposition temperatures and the T-288s were also unchanged.

 

"We are really pleased with the results, IS620 is rapidly gaining momentum as the low-loss product of choice for very high speed applications due to excellent thermal cycling and low loss attributes," said Tarun Amla, VP and CTO.

 

"The Merix lead free testing program is aggressive and materials that successfully pass are robust. These results are very encouraging..." said Doug Trobough, CTO of Merix.

 

The epoxy is currently manufactured in the Isola high performance and quick turn facility in Fremont, CA.

isola-group.com

 

Visiprise Manufacturing 4.0 offers tightly integrated CAPA capabilities, enhanced data customization options, dynamic routings and full production site-to-site data transfer features. The latest release includes more than 30 business processes, giving users production visibility across the global enterprise.

Enhanced features include:

*Product Workbench offers a one-screen vision of the as-planned product definition, giving operators the ability to indicate what item or revisions they want to define or review throughout the shop floor manufacturing process.*Production Site-to-Site Data extends the ability to transfer data between sites, allowing the complete production data - from partial manufacturing at one site to completion at another - to follow the product, providing for detailed genealogy and history down to the sub-assembly level.

*Automated Test Plans enable users to create and test automated data collection plans and will facilitate the future ability to link these data collection plans directly to a single piece of plant floor equipment.

*Dynamic Routing provides the ability to create a routing on the fly, reflecting the nonconforming operation process, and stored as part of the "As Built" record.

*Certifications were enhanced to include assignment at the item, customer-order and resource-enforcing control on the shop floor, including event management for alerts and alarming.  

Visiprise, visiprise.com

SDS130 Magnetically Shielded Surface Mount Power Inductors feature a ferrite core and shield. Designed in a low-profile, compact package with maximum height of 0.118" (3.0 mm), the inductors offer low DCR with high-energy storage. Ideal for input/output of DC/DC converters, signal conditioning and filtering applications.

Offer 26 inductance values from 2.2 to 470  µH, and current ratings from 200 to 3000 mA. Operating temperature range of -40 to +85°C, available on 24 mm tape and reel with 1000 pieces per reel.  

API Delevan, www.delevan.com

 

The 5100H Series of vibration-damping optical tables is available in a variety of sizes and configurations, up to 6'x20'x36". Offers a stiff, highly damped surface with high natural frequency (270 Hz), a core shear modulus of 225,000 psi and flatness of ± 0.005". Feature 3/16" ferromagnetic stainless steel top skin, 3/16" carbon steel bottom skin and a proprietary steel honeycomb core design. 
 
Said to exceed the performance levels of competitive models for maximum dynamic deflection and maximum relative motion (IRDmax). Easily customized, legstands are available in two basic designs (modular rigid upgradeable supports or fully configured state-of-the-art systems) and five standard heights, with load capacities ranging from 500 to 2000 lbs. per leg.
 
Options include special shapes, cutouts and notches as well as a choice of core and skin materials including aluminum, nonmagnetic stainless steel and Invar. Accessories include laser ports, shelves, tabletop enclosures, retractable casters and modular splices for joining tables in "L", "U" and "T" configurations.
 
Kinetic Systems Inc., www.kineticsystems.com

AlphaPREP PC-7030 oxide replacement system produces a highly bondable brown conversion coating on copper innerlayers using horizontal equipment by removing minimal amounts of copper.
 
Specially formulated for low-etch/high capacity operations, offers up to 60% reduction in consumption and waste treatment. Featuring a low copper etch factor of 0.9 - 1.1u, copper loss from fine lines and thin copper is reduced, improving performance on controlled impedance. 
 
Other benefits include:
Reduction in consumption and waste treatment;
Increased peel strengths on High Tg dielectrics;
Less frequent bath changes with increased up-time;
Improved yields and reliability.
 
 
Enthone Inc., www.cooksonelectronics.com

New control and hardware capabilities are available for the Power Column 2 vertical lift module (VLM).
 
Hardware capabilities include an increase in vertical travel speed from 29 in./sec. to 55 in./sec.; specialty trays in widths up to 157" (98" standard) and weight capacities up to 1100 lbs (880 lbs standard).
 
An integrated parts lookup table enables the operator to search for a part number and then have the module automatically retrieve the tray where the part is stored.
 
Other control modifications include new screen designs on the unit's touch-screen keypad. Additional software control choices are also available.
 
Rack-and-pinion drive allows pinpoint retrieval of item trays without adjustment. Available in heights from 10 to 50', features options such as a tilt-tray up to 45°, a lift system that adjusts the height of the pick tray and a lockable powered door.
 
FKI Logistex, www.fkilogistex.com

Soder-Wick Lead-Free Desoldering Braid is engineered for high-temperature, lead-free solder removal. Maximizes heat transfer to the solder joint, melting the solder faster and more efficiently than conventional desoldering braids. Designed and optimized for all lead-free solders, said ton prolong the tip life on soldering irons.

ITW Chemtronics, www.chemtronics.com

 

 

Release 4.2 of the graphical Boundary Scan operating system SYSTEM CASCON features more than 20 new technologies and tools. Besides the Navigator, Component Explorer and an improved programmer, the HYSCAN (Hybrid Scan Technology) addition aids the execution and diagnosis of hybrid formatted test patterns.
 
HYSCAN is  based on a new hardware-independent emulation method and relieves the user from the entire handling of serial-to-parallel vectors. Test program generation and fault diagnosis can be done without  knowing the type of test access. The parallel test vectors are connected with the individually configured pin electronic by means of Wrapper Modules. By exchanging these modules, the parallel vectors can be linked to the required pin electronic without re-compilating the test program. The first supported pin electronic are the parallel I/O modules PXI 5296 and PXI 52192 with 96 and 192 test channels, respectively.
 
The Component Explorer is a graphical tool for the interactive generation and manipulation of intelligent design data. Unknown components and complete component cluster can be defined and implemented into the database. Is directly linked with Scan Vision tools for the visualization of schematic and layout as well as the graphical library.    
 
The Navigator tool for the interactive user guidance gives support in terms of hyperlinks, videos or topic related documents.
 
The new version is downwards compatible to all previous versions and supports all Boundary Scan controllers on basis of VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232 and Fast Ethernet.

GÖPEL electronic, www.goepel.com