Metallic Static Shield Polyethylene Tubing on a roll allows users to create custom-sized poly bags that inhibit electrostatic discharge (ESD).
Laboratory tested; meets or exceeds the electrical and physical requirements of MIL-PRF-81705D Type III and EIA 541 standards. Protects electronics, switchboard apparatus, PCBs, transistors and other sensitive components from EDS damge.
Joins a full line of rolled poly tubing, including clear, black and pink anti-static styles. When used with the Better Bagger 900e, can be cut and sealed to create custom, on-demand bags up to 8" wide and 99" long. Customization can produce lengths up to 240".
Manufacturers can eliminate the need to order pre-made bags in bulk, thus reducing waste and inventory cost. Depending upon the application, the cost of making on-demand bags can average 50% less than the cost of purchasing pre-made bags.
Better Packages Inc., www.BetterPackages.com
DEK has introduced Setup Verification and Traceability for screen printing, to prevent setup errors, maximize screen printing productivity and gather data for continuous improvement. Optional features also now allow manufacturers to achieve board-level traceability.
Includes software and hardware to automatically identify the stencil, paste and other setup variables as the machine is prepared. Verification compares the actual values with those specified in the product file, and can be programmed to halt the machine before printing commences or generate a warning in event of an error. Software supports 1-D and 2-D barcodes, and all data is recorded for analysis.The optional traceability module and conveyor-mounted barcode reader identify each board entering the machine and link the board ID with the setup verification data, which is stored on the machine's hard drive. This delivers board-level traceability for screen printing.
The optional traceability module and conveyor-mounted barcode reader identify each board entering the machine and link the board ID with the setup verification data, which is stored on the machine's hard drive. This delivers board-level traceability for screen printing.Records setup variables, as well as ambient temperature and humidity, operator identity and line identity. Data is accessible via a network connection, can be copied onto removable media and can be used as input to statistical process control tools.
DEK, www.dek.com
Kepco Inc., www.kepcopower.com/rtw.htm
General Purpose Powder heavy-duty ultrasonic cleaning powder is said to be fast-acting and long lasting. Two pounds of concentrated powder make up to 75 gallons of cleaning solution. Each scoop generates 1 gallon of general purpose cleaning solution (scoop provided).
Easy to handle and store, mild to operator hands and biodegradable -- no acid, caustic or fuming problems. Odorless, ammonia-free and non-flammable.
Applications include removal general oils, fingerprints, dust, packaging particulates, light oils and greases from components and products. Safe on all metals including aluminum and magnesium (when rinsed promptly), plastic and rubber components, and glass.
Branson Ultrasonics Corp., www.bransonic.com
PG0255NL series of low profile SMT flat coil inductors feature saturation current rating up to 30 Amps (A) and heating current rating up to 38A. Designed for the multiphase voltage regulator modules (VRM) supporting the increasing current needs of Vcore power in PC notebooks and other DC/DC applications.
PG0255.201NL, PG0255.401NL, PG0255.601NL and PG0255.222NL have inductance values from 0.2 to 2.2 microhenries. VRM designers can tailor their designs for faster transient response with the lower inductance values or lower switching losses using lower switching frequencies with the higher inductance values.
Low direct current resistance (DCR) of 0.55 to 7.0 milliohms and low alternating current loss result in lower copper losses. Inductor windings are made of rectangular copper (flat wire) wound helically, similar to a spring. Has a larger surface area than round wire for reduced skin effect loss. Also provides a self-terminating lead.
RoHS-compliant, standard footprint is 11.5 x 10.3 mm with a low profile of 4.0 mm maximum and operating temperature from -40 to +125°C.
Pulse, a Technitrol Co., www.pulseeng.com
IMD 2297 Quadrature 3dB hybrid coupler is ideal for RF/Microwave and telecom applications. Compact, low profile and surface-mountable, the thick film product on an aluminum nitride substrate operates at 6 GHz with a bandwidth of 10%. Its typical VSWR in matched 50-Ohm alumina system is 1.25:1 or better, with an input isolation of 18 dB or better. Insertion Loss is .6 dB; phase split +/- 3 degrees; and amplitude split +/-.5 dB.
Part dimensions are .322 x .322 in., with a thickness of .025. Other sizes and thicknesses available. Terminal spacing is .205". Input Power is up to 20W depending on base plate temperature.
IMS, ims-resistors.com
B1500A is a Windows-based semiconductor device analyzer that integrates capacitance versus voltage (CV) and current versus voltage (IV) measurements. Provides a complete, self-contained and expandable solution for parametric characterization and analysis capable of handling 65 nm lithographies and beyond. Has a 10-slot configuration and supports EasyEXPERT software.
Supports three SMU types:
o High-resolution SMU (HRSMU)
o Medium-power SMU (MPSMU)
o High-power SMU (HPSMU)
A multi-frequency capacitance measurement unit is also available, and a 4.2 amp ground unit is included.
Besides integrating CV measurement into the device analyzer mainframe, the MFCMU can measure capacitance at up to 5 MHz and provide ± 25 V of DC bias. The combination of the MFCMU and SMUs within the same instrument enables these measurement resources to be more tightly coupled. When joined using the SMU CMU Unify Unit, supports capacitance measurement with ± 100 V of DC bias.
SCUU connects the two SMUs and the MFCMU together and can switch between the measurement resources without using a separate external switching matrix. Software handles all of the IV-CV switching, compensation and return path issues.
Can be used for a range of characterization needs for semiconductor devices and emerging materials, including nanotechnology devices.
Agilent Technologies Inc., www.agilent.com
Visual 3-D Engineering is a computer-based visualization method allows customers to see engineered solutions in full 3-D, including their product or tool in the cart.
The manufacturing solution allows customers to work with Bliss' engineers to share ideas instead of having to build expensive prototypes. Virtually all interference problems faced in new product development are eliminated.
"It is like looking at a photograph of a product that has not even been built yet," said Ken L. Bliss, president and CEO.
Bliss Industries, blissindustries.com
HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.
Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.
Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.Mydata Automation
Zestron Asia Pacific will exhibit solutions for PCB/ceramic hybrids, chip packaging and stencil/misprint cleaning applications at Nepcon Shanghai on April 12 - 15. The Asian technical and sales team can answer your latest questions on lead-free cleaning at booth 2H15.
The high-throughput IX-3000 is a Class 1 UV Excimer-based laser step and scan ablation system for micro-machining, drilling and laser processing.
The high-accuracy mask imaging system for large field of view (FOV) processing applications is also surrounded by a cleanroom enclosure with HEPA filtration.
Operates at 248 or 193nm UV wavelengths primarily; however, customer can choose different lasers, including: large-area patterning, microvia drilling, microelectronics micro-machining; general drilling; manufacture of inkjet nozzle arrays; flat panel displays, wafer-scale processing; sensors; microfluidics; and other applications, all with resolution down to 1 micron.
Optical resolution, repeatability and structural accuracies are sub-micron with 0.2 to 0.3 micron repeatability. Granite-based, vibration and thermal dampened for optimum stability.
Available with cassette-to-cassette wafer handling, panel-handling, robotics handling or tape and reel systems as options. Readily integrates with high-volume part handling systems.
J P Sercel Associates (JPSA), www.jpsalaser.com