MYDATA automation AB announces a new version of its machine control software: TPSys 2.4.3. Designed for high-mix production with sophisticated vision technology and networking capabilities. New features include faster assembly speed and a new calibration method (patent pending).

Placement area calibration methods tend to depend on large, dot-matrix calibration boards that are difficult to manufacture accurately, and are very sensitive to heat and moisture. The new calibration method utilizes a much smaller calibration device that is automatically moved to a number of predefined positions within the placement area. An advanced mathematical algorithm then combines the measurements from each position and calculates the correction data for the entire area. The result is more accurate calibration, using a calibration device that is insensitive to handling and storage conditions.   A number of functions for faster assembly speed have also been implemented. Improvements such as faster tool changes, faster conveyor board changes and faster board level measurement, along with improved optimization, can reportedly boost actual throughput by up to 15%. Features a simplified user interface for operators, and auto-teach of components up to 132 x 26 mm

Developments in the field of electronics manufacturing are characterized by growing demands on quality and throughput rate, as well as the increased use of miniaturization. Automatic optical inspection (AOI) has become one of the pre-requisites in satisfying the demand for zero-defect manufacturing concepts, particularly in small to medium-sized electronics production facilities. Viscom has responded to the requirements of the market and, with the S3088AV, now proudly offers a new AOI system with an attractive price-performance ratio.
 
S3088AV is a cost-optimised system with full reflow inspection capability. The inspection of PCBs is operated in single track mode, enabling the inspection of assemblies up to 400 x 350 mm (14.7 x 13.8"). Full program compatibility with the S6055 is guaranteed.
 
The 4M sensor technology is also used in this system, detecting defects in paste print, component placement and solder joints. The additional use of angled camera modules ensures full-depth inspection and detection of critical errors, such as lifted leads in the fine pitch range.
 
Further highlights include quick and easy program creation using EasyPro and simple program transfer. Additional modules are also available, including a rework station, post-classification station and off-line programming and SPC analysis.
 
Viscom AG, www.viscom.de

 

BP-3106 BGA Bumping Solder Paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil.

Applied using existing equipment, increasing the BGA substrate panel size and printing speed without extra investment in equipment such as BGA ball placement hoppers.

Said to exhibit excellent release properties, robust slump resistance and ultra-low voiding. Can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.

Standard packaging includes 500 g jars and 700 g Semco cartridges. Can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.   

Indium Corp., www.indium.com

 

 

Multicore TTC-LF allows soldering irons to be re-tinned, even when conventional methods such as sponges, pads or rosin-cored solder wire are not effective.

 

Applicable for lead and lead-free applications, the product is a small block of electronics lead-free grade solder powder and flux formed into the shape of a thick disk. For cleaning and de-wetting soldering irons, users need only wipe the tip of the soldering iron gently across the surface to produce local melting and then wipe as normal on a damp sponge to ready the iron for re-use.

Benefits include minimal residues, activators that thermally decompose into inert components and the ability to clean heavily oxidized metal surfaces such as copper and iron plated soldering tips.

Henkel, www.electronics.henkel.com

 

Polyclad Laminates Inc., a business of Cookson Electronics, has introduced Polyclad 250HR laminate and prepreg materials. With a 150°C glass transition temperature (Tg) and 350°C decomposition temperature (Td), is suited for mid-Tg, lead-free applications. The CAF-resistant materials maintain low expansion rates while retaining FR-4 processability.
 
Used in the manufacture of automobiles, computer servers, telecommunications devices and other electronics, said to offer exceptional IST thermal performance and reliability. Contains a multifunctional epoxy resin technology for reduced CTE.
 
Compatible with all commonly used FR-4 fabrication process techniques. Mechanical, chemical and moisture resistance meet or exceed the performance of competitive FR-4 material. Is laser fluorescing and UV blocking for maximum compatibility with AOI systems, optical positioning systems and photoimageable solder mask imaging.
 
Polyclad Laminates, www.polyclad.com 

A major upgrade to the CR-5000 enterprise-wide PCB design suite of tools includes 44 productivity enhancements in schematic capture, layout and simulation.

Version 8.01 is aimed at designers of high-complexity boards that use extreme miniaturization technologies such as embedded passives, flex circuits, high-density interconnects and FPGAs. Capabilities include RF design, design re-use and design partitioning  with core design strengths that meet the requirements of consumer and high-tech electronics applications. Built on the design structure and methodology of version 7.

Enhancements to schematic capture and analysis module include a net connect view, the ability to import and export net label and pin information in CSV format, new fault analysis functions and a property viewer that can be used during symbol re-load. The upgrades to the Board Designer placement and routing module mean that users have use of automatic area correction functionality, benefit from even deeper integration with mechanical CAD and can achieve more consistent star-point connections. The board layout tool can space tracks automatically based on the electrical potential difference between them, and has support for multiple bond wires.

Zuken, www.zuken.com

 

Vibration Isolation Mounts are ideal when designing or retrofitting sensitive OEM equipment where external isolation is not desired or is not suited to the application. Available in a variety of shapes and sizes with load capacities ranging from 200 to 20,000 lbs, and standard heights of 4", 6", 12" and 24".
 
Provide vertical and horizontal vibration isolation with low natural frequencies, automatic leveling and height control to within 0.005", and internal damping for improved stability. Have a standard blue polyurethane finish and are Class 100 cleanroom compatible.
 
Offered in active and slave configurations. Active mounts use the VIBRALEVEL Air Servo Valve to feed or bleed air from the mounts to maintain preset "zero deflection" and compensate for load changes. Slave mounts do not have Air Servo Valves but are controlled by one of the active mounts.
 
Options include a damping tank, a portable air compressor and a white epoxy-powder-coat finish for Class 10 cleanroom compatibility. 
 
Can also be used for steppers, laser trimmers, automated wafer inspection, profilometers and surface-measurement instruments.
 
Kinetic Systems Inc., www.kineticsystems.com

 

At SEMICON West, Speedline Technologies will spotlight the latest platform enhancements and developments of its soon to be released XyflexPro⁺Dispensing System.
 
Delivering an increased speed rating of more than 30% and twice the accuracy,
It features an advanced composite gantry design and linear drive system using motion control drive technology. Available as a standalone or in-line system, can be configured for a range of dispense applications within the electronics, automotive and medical industries.

Also on demonstration at booth 8705:  The XyflexPro HVB dual head dispense system and the Accel MicroCel cleaning platform.  
 
Speedline Technologies, speedlinetech.com

 

Micro-Meter 2 Servo is a positive-displacement, two-component meter-mix dispensing system designed to apply small precision beads and small metered shots of precisely mixed resins. Servo-motor design provides consistent, repeatable bead profiles and variable-flow-rate metered shot volumes. Said to improve production rates and product quality, and reduce manufacturing costs.

Provides a variety of preset material-dispensing profiles and dispense results. Can dispense precisely mixed materials for different part configurations. It can be preset to vary the flow rate during dispensing—to change the bead profile in gasketing or fill rate in potting applications—in automated, indexing, xyz-motion and robotic processes. The control will also accept commands from the automation.

Snuf-Bak or No-Drip dispense valve is provided with seals matched to each dispense fluid and designed for long life in high-cycle dispensing applications. Dispense valve may be remote mounted. Disposable No-Flush mixers mix and dispense virtually all two-component materials including epoxies, polyurethanes and silicones. 

Sealant Equipment & Engineering Inc., www.SealantEquipment.com

 

Integrated Reliability Test Systems (IRTS) Inc. announced that Rockwell Collins has purchased a Highly Accelerated Thermal Shock (HATS) System.
 
The system, scheduled to be installed in September, will service Rockwell Collins' in-house thermal shock testing requirements. Two HATS systems were previously installed at Intel Corp. and the Hong Kong Productivity Council last year.
 
The system, which has been in use by the IPC PCQR² Database for reliability testing of via daisy-chain structures since October 2003, offers:
 
Built on existing air-to-air thermal shock standards (IPC-TM-650, Method 2.6.7.2B)
Reduced operating cost over dual chamber systems
Reduced cycle times by 50 to 70%
36-coupon capacity with 4 nets per coupon
Temperature cycles ranging from -60 to +160°C
20 4-wire precision resistance readings per second
 
Integrated Reliability Test Systems, www.hats-tester.com

 

EM4D-100L is a 2 mm square, 8-pin DFN package, 4-line low pass filter array with integrated TVS diodes. Designed to suppress unwanted EMI/RFI signals and provide ESD protection for high-speed data interfaces such as color LCD displays, camera imagers in mobile phones and PDAs.
 
With a desired cutoff frequency of 150 MHz, provides EMI/RFI attenuation better than 35 dB in the 800 MHz - 3GHz bandwidth. This blocks RF noises from GSM, DCS or Bluetooth, which affect the baseband chipset and other blocks. Meets the immunity test standard IEC 61000-4-2 at all levels, providing ESD protection.
 
In standby mode, integrated TVS filter has a very low leakage current (less than 100 µA) - an essential feature for battery powered handheld devices.  In addition, the low profile durable 8-pin DFN package is useful in many applications.
 
ProTek Devices, www.protekdevices.com

 

For design engineers facing thermal cycling issues with power components in high-temperature environments, IRC has developed a "capped" version of its cylindrical power resistor that delivers thermal compliance and thermal isolation from circuit boards.  The SMC Series Metal Glaze resistors are available in ratings up to 2 watts.
 
Designed to solve the problem of thermal mismatch between FR4 PC boards and ceramic components. 
 
Applications include high power-density applications, such as underhood automotive control units, GFI control circuits, as well as any application where high thermal stress is present. Can be a potential cost saving replacement for bulky surface-mount wirewound devices.
 
Rated for 1 W at 70ºC, with resistance values from 0.1Ω to 1MΩ, in standard tolerances of ±1%, ±2% and ±5%, with TCRs as low as ±25ppm/ºC.  SMC2 Series resistors are rated for 2W at 25ºC, with resistance values from 0..2Ω to 2.2MΩ, in standard tolerances of ±1%, ±2% and ±5%, with TCRs as low as ±25ppm/ºC.   Operating temperature range is from -55° to +150°C.  All are RoHS compliant and suitable for high-temperature soldering processes.
 
Feature a MetalGlaze thick film element fired at 1,000ºC to a solid ceramic substrate and a high temperature dielectric coating that is impervious to degradation in high-moisture environments. 
 
IRC Wirewound and Film Technologies Division, www.irctt.com