This no-drip, Pb-free, no-clean SAC 305 solder paste for mechanical soldering is said to be excellent for gap filling and application on vertical surfaces. Help solder joints around a heat tube (or heat sink) container. Reportedly wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper. 

EFD Inc., www.efd-inc.com

SIP and STRIP male pin headers feature sturdy 0.040" diameter leads; mate to standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2x4) up to 100 (2x50) position configurations on 0.100" spacing. Reportedly creates a high current interconnect rated at 8 amps per position. The low-profile insulator (0.071" thick) is manufactured with high-temperature thermoplastic.  Standard and RoHS plating available. Use brass alloy 360 ½ hard.

Mill-max, www.mill-max.com

Hysol FP4581 and FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is formulated high-lead, bumped large die flip-chip packages. Is said to have low coefficient of thermal expansion properties and improved toughness over previous materials; forms a rigid, low-stress seal on solder joints. Is said to be ideal for flip-chip devices that require improved crack and fracture resistance. Is compatible with most no-clean flux systems. FP4583 is for applications requiring a fine filler. Contains fillers less than or equal to 2 µm in diameter; is formulated for overmolded components.

Henkel Corp., www.henkel.com/electronics

YESTech, www.yestechinc.com

Pyramax 100 reflow oven comes in 8-zone air or nitrogen models, and recaches 350ºC maximum temperature. Is Pb-free capable, reportedly has low nitrogen and power consumption, and uses closed loop convection control. Delivers features like side-to-side recirculation, and convection efficiency that reportedly reduces zone temperature set points. Features Windows-based Wincon oven control software and smart-tracking SMEMA conveyors.  

BTU International Inc., www.btu.com

  

StatNot XC is a static dissipative material that can be combined with existing materials, such as the NP510A fiberglass epoxy composite. The composite surface is said to maintain a surface resistivity of 106 to 109 ohms per sq. Said to be ideal for applications in the electronics assembly market, such as test fixtures and assembly work surfaces. Is tested and certified to a surface resistivity range of 105 to 1010 ohms per sq.

Norplex-Micarta, www.norplex-micarta.com 

PCB Artist software is a free layout package that includes schematic symbol, footprint and part creation wizards to streamline the PCB design process and reportedly reduce component creation time to as little as five minutes. Customers can draw from an extensive library of components. Includes automated component placement and trace routing; back-and-forward integration that permits users to make changes to the schematic that automatically translate to the PCB design. Gerber-formatted files available on request.

PCB Artist, www.pcbartist.com 

The Icon i8 fully automatic screen printer is said to wield high throughput and flexibility. Has been developed to meet the precise demands of the Asian electronics market. Features a high degree of automation; reportedly reduces product changeover time to 2 min. and product setup time to less than 10 min. Delivers a 12 sec. cycle time and 350 x 300 mm max. board dimensions. Includes a compact auto tooling system and advanced statistical process control software; uses SPC techniques; vacuum under screen cleaner; available in 400 and 520 mm widths; paste on pad solder verification. Print speeds from 2 mm to 150 mm/sec.; can handle boards from 40 x 50 mm up to 350 x 300 mm, and a thickness of 0.2 to 6.0 mm. Max. board weight is 1 Kg.

Icon Technologies, www.iconprinter.com

The integrated intelligence concept is based on intelligent feeder and intelligent machine. The feeder records component identity, inventory count and pickup correction so the machine can confirm that it picks the correct component reliably. The machine must be able to enable high throughput when feeders are not in optimized positions. The turret head and machine architecture are reportedly critical to enabling this potential. Said to cope with feeders in any position with limited reduction in placement rate. Every feeder is said to be fully programmable with component and inventory data. Once the feeders are loaded, the machine automatically recognizes the information.

Europlacer, www.europlacer.com

Zestron America, www.zestron.com

Dyne-A-Mite IT CO₂ Plasma is said to provide superior surface treatment to improve adhesion on a wide variety of materials. The use of gas or liquid-phase CO₂ with atmospheric plasma discharge surface pretreatment technology can remove micron and submicron particulates and hydrocarbon-based contaminations on plastics and metals. Increases surface tension of base substrates. Bonding strength is said to be improved. Is suitable for either initial or final cleaning, and for cleaning applications.    

Enercon, www.enerconind.com/treating

The OUC-500 Wave Unload Flat Belt conveyor station provides a means to unload PCBs from the wave. The ESD flat belt is said to be 500 mm and can handle PCBs up to 17" in width. Comes standard with variable speed control and three topside fan arrays. Framing system can be adjusted.

Promation, www.pro-mation-inc.com