The Verifier H Series horizontal beam x-ray inspection system is for industrial, automotive and medical applications. Provides assessment and defect detection of components and assemblies such as inkjet cartridges, automotive sensors, castings, electronics modules and electromechanical devices, and medical assemblies. The four-axis, 360° sample manipulator reportedly provides unlimited viewpoints. Is offered in configurations of 75kV (FSX-H75) for general-purpose applications or 90kV (FSX-H90) for applications requiring additional power. Comes standard with a PC-based VIP image processor.
The Spectrum S-920 series of scalable dispensing features software and hardware control based on Fluidmove XP software with process control features. Rapid response heater system reportedly minimizes startup time and delivers uniform heat across entire part surface. Controlled process heat software can be added. Includes programmable fluid and valve pressure, mass flow control, calibrated process jetting, and a digital vision system. Can be configured with single or dual lanes, and one to three heat stations. Platform can be upgraded and configured to meet dispensing requirements. Uses noncontact jetting technology for applications such as stacked die underfill, chip scale package underfill, and UV gaskets for LCDs. Reportedly dispenses into 200 µm gaps; offers dispensing with flow rates up to 500 mg/sec. and shot rates up to 200 dots/sec. Footprint is 600 x 1321 mm with a single heat station, 850 mm x 1321 mm for two heat stations, and 1100 x 1321 mm for three.
Hysol PC62 toluene-free conformal coating is based on the Hysol PC52 platform; is a one-component solvent-based acrylic conformal coating. Is reportedly quick drying. Designed for harsh environments, particularly automotive, military, aerospace, industrial and consumer avionics applications. Is compliant with UL746 and IPC-CC-830 requirements; is suited to application with non-atomized selective spray coating equipment.
The Quadris-3 quad-gantry model achieves a reported maximum throughput of 95,000 cph by maximizing SW sequences and minimizing delay times between motion sequences. Uses the same software and hardware as the Quadris-S, but with improved ease of use and maintenance. Handles components from 0201 to 44 x 44 mm, in tape and tray feeders including dual-track feeders. Transparent acryl cover on the top and side enhances visibility.
The ShareGen SPA 1000 Solder Paste Analyzer provides testing to control and manage solder paste in the production process. Is said to reduce a range of defects, including missing components, tombstoning, component misalignment, and non-wetting. Reportedly can perform up to six separate tests. Can be used to conduct solder paste open time testing.
The System 855A benchtop rework station’s profiling adjustments include push-button settings for temperature, airflow volume and duration. Unit proceeds automatically through three preheating zones and two reflow zones before auto shutoff. Up to 10 profiles can be stored in the memory. Has temperature range of up to 350°C. Includes external thermocouple on the PCB and an adjustable ceramic underheater. The production cycle begins as a heating nozzle is attached to the head, and then z-lowered onto the component. When reflow is complete, the head is automatically lifted, as solder residue is cleared.
Loctite 3508 cornerbond underfill material for BGA and CSP devices is a one-component epoxy that is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. Can be applied inline with existing capital equipment, with curing during the solder reflow process. Is Pb-free compatible and permits rework. Has a pot life greater than 30 days.
Siplace X4i placement machine is said to have a speed rating of 102,000 cph per IPC-9850, and a maximum theoretical performance rating of 135,500 cph. Features a dual conveyor, in which each of the two heads populates one board independently of the other, shortening travel between feeders and PCB. A third transport track moves PCBs through the machine to be processed in parallel on another machine. Another feature pushes two boards together on a single track and processes them as a single board.
Indium8.9 no-clean Pb-free solder paste reflows in air and is said to be probe testable, low voiding at via-in-pad and in BGAs/CSPs, and easy to print and wet. Formulated to produce consistent print volumes even through stencil apertures below 0.66 ratios. Voiding reportedly in 5% range over many profiles when soldering BGAs with via-in-pad.
PowerstrateXtreme Dispensable (PSX-D) is a phase change material that is said to offer many advantages of thermal greases. Remains solid at room temperature; becomes liquid when exposed to heat. Wets surfaces and fills surface irregularities with thermally conductive particulates. Thickness can be adjusted depending on the requirement. Can be stenciled, needle-dispensed, screen-printed or manually applied onto a heat sink or other surfaces. Cures and dries into a solid phase change material. Can be used as a TIM2 material for between microprocessors, IGBT, FBDIMM/Memory, GPU, MCMs, ASICs and active heatsinks. Is reworkable and repeatable.
Premier PEI-140 lightweight, electrically conductive plastic is for EMI shielding of high-temperature avionics. Is said to maintain high-temperature tolerance, chemical resistance and UL 94V-0 flammability rating for a shielding solution up to 85dB in aerospace applications. Complies with avionics smoke density requirements. PolyEtherImide was chosen for its thermal resistance, mechanical properties, flame resistance and low smoke generation. Is an amorphous thermoplastic reinforced with matrix of proprietary conductive fillers. Continuous use at temperatures up to 340°F.
Una Guiÿa Praÿctica para la Serigrafia (A Practical Guide to Screen Printing) is a Spanish-language primer covering the screen-printing process. Includes photos and diagrams that illustrate the process from start to finish. Includes step-by-step instructions on mesh stretching to frame exposing. Other topics include setting up shop, handling ink, making frames, preparing stencils, and squeegee selection and technique. Features comprehensive glossary of screen printing terms and troubleshooting tips for commonly encountered issues. AWT World Trade Inc., www.awt-gpi.com