Circuits Assembly Online Magazine - News

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vPlan version 1.2 introduces features intended to enhance the ability to transfer production between lines and factories, even when CAD and AVL data are not available. Reportedly can create efficient manufacturing process definitions, even when incoming data are of poor intelligence-level. Adds coverage for additional machine models. New features include re-optimization of legacy NC programs; the ability to import existing machine programs; re-engineering of Gerber data; extraction of footprint data and component list from Gerber; enhanced ability to align CPL data with Gerber data; bottom-up auto generation; alternate IPN Support; moving BoMs from one line to another and moving parts data automatically; standard workflows; 10,000 vShapes added to built-in shape library.

Valor Computerized Systems Ltd., www.valor.com

iMentor is a Web-based training and support system that incorporates step-by-step guidance supported by screen shots. Can set up programs while navigating through easy-to-follow instructions. A search feature enables users to input keywords to find corresponding articles from the online manual. Acts as a portal to the latest product and company information. Front page instantly alerts users about new software releases and MainStampLibrary updates. Can be used offline.

Marantz Business Electronics, www.escapethegreyworld.com

The S3088-II high-speed AOI system includes Viscom 8M sensor technology and an EasyPro3D user interface. Offers inspection of assemblies on PCBs up to 450 x 350 mm. On-demand high-res enables a resolution of 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis. Can inspect components as small as 01005. Offers color evaluation as standard. Operator interface comes with automatic parameter optimization and a comprehensive LIB2007 inspection library. Library contains more than 1,600 component types.

Viscom Inc., www.viscom.com

EZReball solder ball preform is said to simplify the reballing process. Permits reliable replacement of solder balls on a BGA device. Alignment is reportedly simple with the edges being “squared up” with the sides of the package; is said to eliminate the need for custom frames or fixtures. Adhesive holds balls firmly in place until after reflow. After reflow, the stencil is peeled off. Comes in packages of 15. Stencils are custom made, including SnPb and Pb-free alloys.

BEST Inc., www.solder.net

EnviroMark 923 is a halogen-free, Pb-free and no-clean paste. Is said to have excellent wetting, low voiding and soft pin probeable residues. Reportedly has consistent solder paste volume deposits regardless of idle time, stencil life and print speed. Offers 0201 print and reflow capabilities with standard Type 3 powder. Capable up to 200 mm/sec print speed and bridge resistant.

Kester Inc., www.kester.com

EnviroMark 828 is a Pb-free water-soluble paste with ultra low BGA voiding. Is said to create no foam in inline washers and has excellent solderability. Has non-slumping chemistry.

Kester Inc., www.kester.com

The DXBG bench dispenser is for two-component reactive resins of a variety of ratios. Permits A and B components of flowable adhesives to be gravity-fed from separate, refillable two-gal. containers. Components are forced by metering rods directly into a disposable static mixer. Comes with a foot pedal actuator. Permits hands-free operation. Stand is adjustable over three axes.

Mixpac Equipment Inc., www.mixpacequipment.com

MPM 125 screen printer is for low-to-medium volume applications. Reportedly features ±12.5 µm accuracy at Six-Sigma, with Cpk ≥ 2.0. Includes CANOpen motion control architecture, benchmarking software and Windows XP, and setup Wizards for ease of use.

Speedline Technologies, www.speedlinetech.com

High retention Type A and B USB interfaces (USBR Series) are said to comply with the Class 1, DIV II minimum withdrawal requirement of 15 Newtons. These connectors have an orange color-coded insulator to differentiate them from standard withdrawal force connectors. Are available in surface mount and through-hole designs with a choice of standard right angle or vertical top-entry orientation.

Samtec, www.samtec.com

A scaled-down version of the MK-II, the Advantage 16e, was designed to counteract any penetration by smaller knockoffs of the MK-II in Asia. Is said to be stripped down for buyers looking for lower cost system. Is about ¼ the size of MK-II and includes fewer operational controls, including recordkeeping. Includes vacuum pump, booster blower and unitary chassis design. Includes 16 level, horizontal planar electrode configuration (24" W x 18" D x 1.25" spacing), 1,000W 13.56 MHz solid state air-cooled R.F. generator, process temperature control, two mass-flow meters with precision needle valve, automatic nitrogen purging and touch-screen interface.

Plasma Etch Inc., www.plasmaetch.com

This joint-effort design solution reportedly can improve productivity for the design of RF circuits. Is expected to cut PCB design cycle times in half and improve quality of mixed-technology designs. Enables PCB mixed-signal designers to concurrently design a PCB using Expedition Enterprise or Board Station XE flows and integrate it with Advanced Design System EDA software.

Mentor Graphics, www.mentor.com/go/pcbinnovation

Agilent Technologies Inc., www.agilent.com/find/eesof-adsent.com

Pyramax 75A features 75" of heated length and six zones, 350ºC maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. Is said to deliver side-to-side recirculation and convection efficiency. Includes Windows-based WINCON oven control software, parts-identification software, a range of options for flux management, advanced conveyor solutions and smart tracking SMEMA, optional barcode reader, and a comprehensive warranty.

BTU International, www.btu.com