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ESD antistatic wrist straps are adjustable and comfort-stretch. Offer a 1 MΩ resistor and a choice of a 6 or 12' coil cord and 1/4 or 3/8" snap.
 
ESD antistatic heel straps attach to shoes and provide a large contact surface. Width of grounding area is said to provide good floor contact.
 
ESD antistatic three-layer vinyl floor and table mats are used to assist in ESD protection. Use a three-layer construction consisting of conductive metalized fleece sandwiched between a vinyl top surface and a foam bottom layer. Two-layer rubber floor matting is comprised of a top antistatic layer and a conductive bottom layer to provide a high-temperature static dissipative surface.
 
ESD nylon gloves are static dissipative with cleanroom quality. Are breathable with conductive fibers running through the glove. Six dozen gloves per case.
 
ESD FCS-F6R static dissipative finger cots are available in S, M, L and XL. Are spore black, powder-free and come rolled or unrolled, with 720 pieces per bag.
 
Vision5 ESD cleanroom laundered wipes feature conductive fibers knitted with continuous filament polyester for low lint properties. Are said to be abrasion resistant, low in nonvolatile residue and ionic levels, individually inspected and double-bagged in cleanroom bags. 
 
ESD static shielding bags are non-corrosive and feature high seam strength. Reportedly provide low surface resistivity and are available in numerous sizes and thicknesses. Static and/or moisture barrier types of bags are available.
 
ESD swabs are safe for static-sensitive surfaces. Are said to be absorbent and low in particulates. Four types are available with 50 swabs per bag: A1806-PF features an overall handle length of 6" with an antistatic polyolefin handle and an antistatic foam head. Head width is 3/16" and length is 11/16"; A1806-WCF features a handle length of 6" with a wooden handle and an antistatic foam over a regular cotton tip head. Head width is 3/8" and length is 1"; A1806 WF features a handle length of 6" with a wooden handle and an antistatic foam head. Head width is 3/16" and length is 13/16"; A1805-PF RECT features a handle length of 5 1/8" with an antistatic polyolefin handle and a rectangular antistatic foam head. Head width is 11/16" and length is 11/16".
 
ESD brush bristles are made from conductive fibers mixed with natural hair. Handles are made from static dissipative plastic. Will not create a charge. Available in three bristle types: hard, semi-fine and fine.
 
Blue Thunder Technologies Inc., www.bluethundertechnologies.com 
 
The S3X48 Series halide-free no-clean solder pastes from Koki Company Ltd. are said to demonstrate excellent performance across a wide range of Pb-free processing applications. Developed originally for fine-pitch BGA and CSP applications. Perform well at high reflow temperatures; rapid wetting of commonly used Pb-free alloys. Have a wide process window and six-month shelf life. Are said to eliminate “pillow” defects on BGA and CSP devices.

Christopher Associates Inc., www.christopherweb.com
The ShareGen SPA 1000 solder paste analyzer provides testing to help control and manage solder paste in the production process. Is said to help reduce defects, including missing components, tombstoning, component misalignment and non-wetting. Is a 6-in-1 solder paste test system that reportedly can perform up to six separate tests that previously would have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. Can be used to conduct solder paste "open time" testing.

Ascentech LLC, www.ascentechllc.com

The OUC-500 wave unload flat belt conveyor now has three banks of cooling fans. Unloads and cools PCBs exiting the wave soldering process machine. Is variable speed controlled. Has 500-mm wide flat belt and is said to be capable of handling PCBs up to 17.7" in width. Open framing system can be adjusted to meet most wave exit and off-load heights. Three fans per bank (nine fans total) provide cooling for higher temperature Pb-free products.

Promation Inc., www.Pro-mation-Inc.com

 
 
Surveyor monitors the thermal performance of a reflow oven every hour, day and shift. Features include SPC analysis and out-of-tolerance condition identification. Is said to eliminate the need for test boards, while simplifying profiling. Consists of fixed sensors that reportedly eliminate variables associated with thermocouple attachment, an adjustable frame that rides on the oven’s rail or mesh belt, and new surveyor software that automatically stores profiles.
 
Datapaq, www.datapaq.com
 
CmController5 Compact measurement and analysis tool is designed as a universal measuring and analysis tool for SMT production. Includes a complete measurement system with measurement software for vision and statistical analysis. Helps analyze production process with error rate reduction. Offers a third-party independent method and validation for ISO, IPC and automotive standards. Weighs approx. 130 kg. Can be equipped with a wheel lift system.

CeTaQ, www.cetaq-americas.com
 
The SCBL-99 15 Vertical Buffer station has new software, including a hold and release timer function and system status monitoring menu. Is said to permit selection of a desired minimum buffer time before release. Is a 15-slot vertical buffer designed to control line flow. Can handle PCBs up to 18" in width and 20" in length. Current modes of operation include LIFO, FIFO or PASS through conveyor. Has all-belt buffer design. Monitoring screen shows current status of the station.

Promation, www.Pro-mation-Inc.com

The KE-2060 light high-speed flexible mounter (limited edition) comes with a quadruple placement head with laser alignment, one high-precision placement head, and vision and laser alignment. Is rated per IPC-9850 at 12,500 cph (laser alignment) and 1,750 cph (vision centering). Handles components ranging from 0201 to 75 x 75 mm or 50 x 150 mm, and up to 12 mm in height. Placement accuracy is ± 30 µm @3 Sigma using vision centering and  ± 50 µm @3 Sigma using laser alignment. Options include exchangeable feeder trolleys, a high-precision camera for µBGA and 0.3 mm pitch BGAs, and TR-6 matrix tray changer.

Juki Automation Systems, www.jas-smt.com

 
The iPAG integrated paste and glue dispenser module is production ready and can be integrated within EKRA's high-end printers. Comes with single or double heads, permitting glue, solder paste or both to be applied to substrates after printing.
 
The SonoDry 1000 spray drying system has a nonclogging ultrasonic spray nozzle. Is said to be suitable for aqueous/aqueous and solvents/solvents feeds. Features an ambient drying temperature of 250°C, accuracy of ±1°C (steps of 0.1°C through PLC) and an air heater capacity of 1.8 kW. Has a blower capacity of 120 Nm3/hr.; 0-250 mm of water column vacuum and a feed pump capacity of 1600 ml/hr. with a 2 mm ID tube controlled through PLC. Weighs 90 kg; is portable on wheels and has dimensions of 650 x 1625 x 55 mm. Three models are available: SonoDry 750 Twin Cyclone Table Top System, with a water evaporation rate up to 750 ml/hr; SonoDry 1000 Twin Cyclone Mobile Stand-Alone System, with water evaporation rate up to 1000 ml/hr; SonoDry 1500 Advanced Twin Cyclone Mobile Stand-Alone System, with water evaporation rate up to 1500 ml/hr. Sizes range from small tabletop R&D systems to advanced floor models.
 
Sono-Tek Corp., www.sono-tek.com  
 
 
The Slice-Filter-Technique is for double-sided PCB solder joints inspection. Complete object information is included. Is based on an image-processing algorithm that separates image data of the printed sides. Uses pattern matching methods for solder joints and components. Is for prototypes and small batch production. Can test and verify the complete batch or complete series of the product type for the upper side and bottom part. Comes on all MatriX X2 and X 2.5 series models; is offered as upgrade package for the previous MX model. Designed for an inspection area of up to 460 x 350 mm and a variable inspection window of 10 x 10 mm to 30 x 30 mm. Reported resolution to below 5 µm; inspection time is 4 images/sec.
 
MatriX Technologies, www.m-xt.com
 
The Firefly laser-based selective soldering system includes a new automatic development environment said to reduce program time. Improved algorithms and faster loop control reportedly enable automatic management of PCB characteristics and environmental factors. X-Y-Z control of the laser head enables control of the position of the laser beam, rotating it 180° around the pin or joint to be soldered.

Seica S.p.A, www.seica.com 
 

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