The upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard.
 
YESTech Inc., www.yestechinc.com

The PC3200 series of fast-setting, one-component conductive adhesives is for connecting passive components and bare dies on lead frames and PCB substrates. Uses are said to include smart cards and flexible circuits found in camera phones, automotive or semiconductor applications. Is a one-part system that reportedly requires no premixing. Does not have to be stored below 40ºC, nor shipped in dry ice. Solvent-free and formulated for stencil print, screen printing or dispensing applications.
 

 

KIC Explorer 9 thermal profiler uses modern hardware and features a total of nine thermocouples using the standard type K TC connectors. The channel completes the range of compact profilers. Software is said to be easy to use. The optional auto-focus process optimization software automatically selects the best oven setup for each application.
 
KIC, www.kicthermal.com
 

Zestron DS 100 solvent-based defluxing agent is for water-free and low-temperature cleaning applications. Is designed to remove flux residues from assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. Is said to ensure extended bath life, short cycle times and residue-free drying. Is halogen-free; meets new RoHS and WEEE guidelines.
 
Zestron America, www.zestron.com
 

e.dot+ compact electric hot melt adhesive guns are said to offer a combination of accurate dot or bead placement, easy installation and quiet operation, while requiring minimal space for installation and service. Reportedly ideal for high-speed dotting applications. Operate in combination with a small diameter hose and an external gun driver, permitting direct plug-and-play connections between the adhesive melter, gun, driver and hose. Are said to have on-times as low as 0.4 ms, cycle rates as fast as 1.8 ms, and a service life in excess of 200 million cycles. Features a removable armature and seat, and a number of interchangeable nozzles. Manual stroke adjustment permits re-zeroing of the module after servicing.

Nordson Corp., www.nordson.com
 

A dummy version of Amkor's FusionQuad lead frame-based plastic package is available. Is based on the addition of exposed bottom lands within a standard VQFP package format. Is said to extend the I/O range of classic leadframe packaging to nearly 400 unique pins; delivers an approximate 50% reduction in package size for a given leadcount. Reportedly provides short signal paths to bottom lands and high power dissipation capability with the solderable exposed die attach paddle.
 
Practical Components, www.practicalcomponents.com
 

Data Miner 2.0 data reporting software for manufacturing is said to bring the concept of lean to the development of manufacturing reports and analytics. Reportedly can retrieve, visualize, interrogate, and report on process, quality, production WIP, traceability, and performance information without requiring IT assistance, any database or reporting skill. Provides interactive, graphical way to incorporate historical manufacturing data in preconfigured reports without employing SQL. Reports are readily saved and delivered later by email or Web-based access. Once report is created and saved, the system can generate and send a report automatically. May be used alone or with iMonitor.
 
Aegis Software Corp., www.aiscorp.com
 

TechniShield is a plating process for individual shielding of active components. Offers direct plating to the molding compound; is said to create nonporous deposit that eliminates the need for metal caps or lids. Uses novel chemistry to roughen and plate the epoxy molding compound. Is chrome-free. Reportedly maintains excellent adhesion through multiple reflows and produces a pore-free surface.
 
Technic Inc., www.technic.com    
 

2200-545 Series adjustable stroke mix-dispense valves are designed for controlled flow of 2-component adhesives and sealants, such as silicones, epoxies, urethanes and acrylics. Are based on the No-Drip valve body design for fluid control, featuring the integration of carbide ball-end needles and carbide seats. The adjustable stroke feature permits the operator to fine-tune the flow rate by rotating the threaded stem on the back of the valve. The valve is also available with an eyelet stem for attaching to a tool balance. Are 2.25" in diameter by 5.5" long, and are rated for 3,500 psi (240 bar). Double air actuated with two 1/8 NPT ports for a 4-way pneumatic valve connections.  Body has two 1/4 NPT fluid inlet ports for Part A and B materials and accepts a wide variety of motionless mixers; has two screw holes and two dowel holes.

Sealant Equipment & Engineering Inc., www.SealantEquipment.com/2200-545