The SP150 printer is a manual or semiautomatic printer with metal or rubber squeegees. Features squeegee lengths of 130 mm, 220 mm, 260 mm, 300 mm or 400 mm. Has an adjustable print pressure force of 4-140 N, programmable printing speeds of 10 to 99 mm/sec, and adjustable separation speed from 1 to 5 mm/s. Print cycle counter records from 0 to 999,999. Has a manual drawer and manual drawer alignment. Reportedly can handle PCBs up to 410 mm x 400 mm, a print table of 460 mm x 520 mm, a maximum printing area of 390 mm x 360 mm, and a substrate height from 1 mm to 4 mm. Provides manual width adjustment, two support bards with lengths of 410 mm, four vacuum fixation pins, 10 support pins, two centering pins with 3 mm diameters, and a Venturi-type vacuum pump. Features XY alignment range of ±3 mm, theta of ±2° and accuracy of ±30 µm. Is said to print maximum frame size of 23" x 23".

Essemtec, www.essemtec.com

The VWP-500 wafer pen is said to accept all of the company’s press-fit wafer tips and an adaptor that accommodates die/SMT handling tips. Available for handling wafer sizes from 2" to 12" in diameter, and for 1/16" ID or 1/8" ID vacuum hoses. Is available as a standalone wafer pen or as a kit with vacuum hose, holder, vacuum source and wafer tip.

Virtual Industries Inc., www.virtual-ii.com

VisualCAM 2006 and GerbTool 15.2 feature version 8.0 ODB++; flip panel; IPC-D-356B support; nearly 200 enhancements and defect fixes; ability to “see through” composite layers, and flying probe test point generation. Choose to export full IPC D-356/A/B (with 099 records for test points) or scaled-back version with test point features only.

Wise Software Solutions Inc., www.wssi.com

Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.

Kester, www.kester.com

A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.

RMD Instruments LLC, www.rmd-leadtracer.com

SchmartSolder is said to make hand-soldering through-hole components simple. Is loops of solder produced to fit over component leads. Reportedly melts and flows into the hole quickly.
 

SchmartBoard, www.schmartboard.com

The scanner-based FA-Inspector optical inspection system uses a high-res scanner and computer-based image processor to provide image acquisition, fault identification and SPC reporting. Incorporates proprietary optics, custom illumination and AOI Software. Board handling is said to be up to 19" x 24" with area of inspection of 11" x 16" in a single scan. Defect coverage includes SMT and PTH parts down to 0402, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences. Two modes of operation: AOI and Comparator.

FocalSpot Inc., www.focalspot.com

Turbo-Coat Acrylic Conformal Coating is designed to speed up board production throughput without additional UV systems or other capital equipment. Is said to dry tack-free in three min.; full cure achieved as quickly as 10 min. with elevated temperatures. Can be sprayed or brushed; boards can be dipped directly. One-pass application; IPC-CC-830 and MIL-I-46058C tested; UL94 V-0 rated; UV indicator for black light QC inspection; MEK, Toluene and Xylene-Free; adjustable spray head.

Techspray, www.techspray.com

Alpha POP-959 Pb-Free, no-clean solder paste is designed to deliver repeatable paste volumes for PoP assembly. Provides flux and solder powder. Designed to minimize expensive rework and scrap. Is said to offer resistance to shear forces associated with PoP dip application equipment. Reportedly maintains rheology for at least 24 hrs. Is said to be ideal for 150 to 300 µ offset chip scale packages, while leaving a clear, colorless, residue with high electrical resistivity.

Cookson Electronics Assembly Materials, www.cooksonelectronics.com

The KDS-101 bench-top solder dross recovery system from Koki Tec Corp. recovers purified solder from dross in all soldering operations. Recovered solder can be immediately reused and dross disposed of efficiently.

Christopher Associates Inc., www.christopherweb.com

Trident III is an automatic defluxing and cleanliness testing system said to be capable of removing all flux residues, including rosin, no-clean and water-soluble. Both lead and Pb-free flux residues may be removed. Is equipped with automatic chemical injection system that automatically adds a programmable volume of defluxing chemical to wash water. Has a closed-loop wash solution recycling system. Is equipped with programmable maintenance reminders, remote SPC viewing, SPC data USB export and a built-in chemical management system. An optional zero-discharge evaporation system eliminates connection to a drain line. Is reportedly the fastest batch-format defluxing system available. Throughput rate determined by board size. Is capable of defluxing and cleanliness testing up to 200 4" x 6" boards and up to 28 18" x 20" boards per hr.

Aqueous Technologies, www.aqueoustech.com