The PRO 2418 batch process style Laser Marking system has been designed to provide a means to mark a variety of PCBs. Said to handle PCBs up to 18" in width and 24" in length. Features include 40 W CO2 laser, red dot pointer, integrated PC with graphics, text, numeric and barcode software, and see-through laser-compliant glass.
The APR-5000-DZ advanced package rework system uses a dual convection bottom-side heater to enable controlled heating for rework of high thermal demand boards, including lead-free and multi-layer assemblies.
The PCT-100 focused preheater convection tool is said to maximize responsiveness to eliminate the threat of temperature overshoot. Reportedly ideal for use with lead-free and lead-rich solders. Said to deliver a preheat capability to enable manufacturers to perform assembly tasks at the appropriate peak temperatures without distorting the board.
The DX-250 digital dispenser reportedly allows manufacturers quick task setup. The DX-350 is said to dispense precise fluid volume with consistent high accuracy and repeatability.
The upgraded BVX-200 fume extraction system uses brushless motor technology. Is designed to extend operating lifetime, while enhancing performance.
The Electronic Self-Cleaning Metal Squeegee is said to provide a solution to solder paste dripping and clogging. Reportedly improves maintenance of the printer area, with less contamination of floors and surrounding SMT printer components when removed from printing machine. Said to enable hands-off, automatic squeegee cleaning of solder paste (including lead-free solder paste). Incorporates an odometer that counts the number of prints the squeegee has experienced, and allows the user to set a limit, after which a red light will flash indicating that the limit has been reached. Is available for EKRA, DEK, MPM, and Panasonic printers. Retrofits for other printer models are available on request.
The Video ESD Training for Operators series, ESD: An Introduction, Manufacturing Controls, and Personal Grounding, focuses on electrostatic discharge control. Is targeted to electronics manufacturing facilities that require controls for ESD sensitive components and assemblies. Said to explain the importance of controlling static in the workplace, how static occurs and how to protect against discharge that can damage static-sensitive components.
Selective soldering systems with internal (integral) preheating modules are for large, high-mass assemblies in which process heat is applied only to the bottom side. Said to promote the draw of solder through the barrel to the board topside. Includes continuous preheat during selective soldering.
HD Grid-Lok is a high-density tooling solution designed to support entire PCB assembly without manual intervention. Its 12 mm pin pitch reportedly can be set up in seconds. Is said to be ideal for high changeover manufacturing environments. Is based on a modular foundation concept; reportedly will conform to any board profile and to individual substrate topographies, with pins automatically locked into position.
FLO/PCB Version 4.1 thermal design software includes the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. Is said to make it possible to perform board-level thermal simulation early in the design process. Includes a SmartPart object used to represent epoxy type solid cured potting compounds; can be placed over all or part of either side of the PCB. Multiple potting compound regions reportedly can be defined. Provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. Using legend scaling options, users can define minimum and maximum values for the upper and lower bounds of the scale. Also includes an advanced search capability. Maintains bi-directional connectivity with Version 7.1 of Flotherm.
The 6-Pack Analysis Package is a sampling service designed to define the cleaning bath loading capacity for inline and batch cleaning processes. Consists of a set of sample bottles for regular sampling directly from the cleaning tank. Each sample is subsequently returned to the analytical center for detailed analysis. A bath-loading report is provided to users, including recommendations on how to further extend the cleaning agent’s bath life.
The RO300FC full convection reflow oven has four zones (three heating and one cooling), for all soldering and curing tasks. An inert gas model is also available, and changeovers between air and nitrogen are said to take less than 5 minutes.
The unit is 78.8 x 28 x 47.2". Solder width is 11.8", transport speed is 4 - 31.5".min.
Between heating zones is a "stream seal" that permits temperature differences between two zones up to 90°C (194°F).
Comes with optional RO-CONTROL software, which simulates new processes prior to soldering and graphically compares temperature profiles.
The Juki 350 selective soldering system comes standard with an X,Y, Z and A axis servo drive and is equipped with all the functionality necessary to begin production immediately. Includes a soldering unit that features forced hot air nitrogen preheat at the mini-wave nozzle. Nitrogen preheat limits dross buildup, opening the process window and reducing maintenance. An innovative nitrogen management system is used to reduce nitrogen consumption. Other standard features include a spray fluxer or micro-dot drop jet fluxer mounted on an individual A axis servo drive; 5-liter pressurized flux tank; an exchangeable quick exchange mini-wave nozzle from 4 to 30 mm in diameter (custom nozzles are available by request); exchangeable Pb-free ready solder pot with 110 lb. capacity; auto feeder solder roll for maintaining solder pot feed level; a wave height on/off control feature; online/offline programming software that can accept images such as JPG, BMP, TIF, as well as Gerber files for easy programming with a simple to use GUI; and a float sensor for keeping constant levels of solder in the pot at all times. Comes with dual nozzle and dual fluxing capability.
PCS peelable coating mask is a flexible synthetic acrylic latex designed to withstand coating and wave soldering processes. Is water-based and environmentally friendly. On application the mask is orange and darkens once cured. Said to it peel easily after curing. Reportedly noncorrosive to most substrates, with good solvent resistance. For masking components, connectors and other items during a conformal coating process. Is suitable for dip, spray or brush applied conformal coatings.
The BC-60 edge carry transfer conveyor is 600 mm in length and has a single drive; the BC-100 comes with a single 1M drive or 2-500 mm drives. The ESD edge belt is 3 mm wide and can handle PCBs up to 18" in width. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with both hand and foot pedal for PCB release, and programmable logic controller.