The System 855A benchtop rework station’s profiling adjustments include push-button settings for temperature, airflow volume and duration. Unit proceeds automatically through three preheating zones and two reflow zones before auto shutoff. Up to 10 profiles can be stored in the memory. Has temperature range of up to 350°C. Includes external thermocouple on the PCB and an adjustable ceramic underheater. The production cycle begins as a heating nozzle is attached to the head, and then z-lowered onto the component. When reflow is complete, the head is automatically lifted, as solder residue is cleared.

Manncorp, http://www.manncorp.com/specialty-soldering-equipment/855-solder-rework-station/ 

 

Siemens, www.siplace.com

Indium8.9 no-clean Pb-free solder paste reflows in air and is said to be probe testable, low voiding at via-in-pad and in BGAs/CSPs, and easy to print and wet. Formulated to produce consistent print volumes even through stencil apertures below 0.66 ratios. Voiding reportedly in 5% range over many profiles when soldering BGAs with via-in-pad.

PowerstrateXtreme Dispensable (PSX-D) is a phase change material that is said to offer many advantages of thermal greases. Remains solid at room temperature; becomes liquid when exposed to heat. Wets surfaces and fills surface irregularities with thermally conductive particulates. Thickness can be adjusted depending on the requirement. Can be stenciled, needle-dispensed, screen-printed or manually applied onto a heat sink or other surfaces. Cures and dries into a solid phase change material. Can be used as a TIM2 material for between microprocessors, IGBT, FBDIMM/Memory, GPU, MCMs, ASICs and active heatsinks. Is reworkable and repeatable. 

Henkel, www.henkel.com/electronics

 
 

Una Guiÿa Praÿctica para la Serigrafia (A Practical Guide to Screen Printing) is a Spanish-language primer covering the screen-printing process. Includes photos and diagrams that illustrate the process from start to finish. Includes step-by-step instructions on mesh stretching to frame exposing. Other topics include setting up shop, handling ink, making frames, preparing stencils, and squeegee selection and technique. Features comprehensive glossary of screen printing terms and troubleshooting tips for commonly encountered issues.
 
AWT World Trade Inc., www.awt-gpi.com

 

HLX8100 is a placement system featuring a feeder capacity of 192 x 8 mm and programmable feeders. Can accommodate speeds up to 11,250 cph. Is designed for high-mix/high-speed production. Linear drives are said to be maintenance-free. During placement, the board is fixed. Uses collect and place method. Comes equipped with one placement head with four vacuum nozzles. Cognex Vision enables alignment and checking of components. The alternative HLX8200 model features two heads and accommodate speeds up to 22,000 cph.
 

SP003-MLV semi-automatic stencil printer features trans-stencil vision. Offers motorized print head and vertical stencil separation. Can accommodate stencils or screens up to 23 x 23". Is available with different print mounts. Is said to be ideal for small- and medium-volume production. Can print a maximum of 400 x 410 mm, features two cameras and is 700 x 800 x 500 mm (without the optional substructure).

 Essemtec, www.essemtec.com

One-Step Underfill 688 is a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies. Acts as a flux and an underfill. May be applied directly after the SMT printing process and cured during the standard Pb-free reflow process. Can be used in mixed alloy solutions, such as Pb-free BGA on a tin lead board. Is said to offer reliability through high Tg, low CTE, and good fill with no voiding. Is compatible with no-clean flux residues. May be reworked at 120°C. Viscosity reportedly remains stable throughout shelf life. Wets to OSP, ENIG, immersion silver and immersion tin board surfaces.
 
AIM, www.aimsolder.com