ScanINSPECT VPI is a process control tool that is said to qualify each step of the assembly and fabrication process before production. Is a standalone system that couples a high-res, color flatbed scanner with a dual lighting system. Said to validate process in all phases of production, including design; board fabrication; bare board, stencil and component inspection; deposition and component mounting, and finished boards using a calibrated scanner and dual lighting system. Uses Gerber, CAD or Golden part data to validate board fabrication, stencil cleanliness, paste/adhesive deposition and populated boards. Users are said to be able to check holes, slots and artwork; ensure parts from multiple vendors conform to the required shape, position, color and size; detect stretch, wear, blocked or damaged apertures; ensure new stencils and screens match board revision or that cleaning operations are successful. Reportedly can use to build part libraries direct from components.

ScanCAD International, www.scancad.com

EnviroMark 919G Pb-free solder paste is reportedly 100% halide- and halogen-free. Said to offer ultra-low voiding characteristics, lighter flux residue color, easier residue penetration, shiny joints and excellent solderability on all components and board finishes. Prints to 0.4 mm pitch. Said to reduce potential defects such as bridging, solder balls and tombstoning.

Kester, www.kester.com

The S3088-II high-speed AOI system includes 8M sensor technology and EasyPro3D user interface. Is said to provide reliable post-reflow, post-print or post-placement inspection. Offers inspection on PCBs up to 450 x 350 mm. Reportedly provides a resolution of 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis and permits inspection of components as small as 01005. Offers color evaluation as standard. Operator interface comes equipped with automatic parameter optimization and LIB2007 inspection library that contains more than 1,600 component types and takes into account IPC standards. ‘ValidCompare’ mode provides the operator with an archived image as a good-board reference. ‘TrustedChange’ integrated verification is said to simplify the reduction of false calls and ensures a zero-escape strategy.

Viscom Inc., www.viscom.com

This centralized pallet product line reportedly provides customers the opportunity to procure all assembly tooling from a single source using existing data from the Gerber files. Now includes ESD-safe process carriers for wave solder and SMT assembly. The carriers, said to be ideal for use with lead-free solder, allow masking of specific areas. Boards and components are protected from thermal shock and ESD. Utilizes materials said to be ideally suited to the soldering process, including Durapol and Delmat.

Photo Stencil, www.photostencil.com

3000FS Flashstream automated programming technology is designed specifically to solve excessive programming times in current in-system, JTAG and in-circuit programming production methods. Is modeled from the BPM 3710 handler and contains four Flashstream programming sites. Said to be rated at 1050 devices per hr. and handles parts in tray, tube or tape for device input or output.

BPM Microsystems, www.bpmmicro.com

RGSW and RGSWX series slides are for packaging, assembly, medical and life sciences, semiconductor manufacturing and factory automation. Reportedly permit high linear speeds without critical speed concerns. Have thicker and wider bases than original and are more compact. Include direct sensor mounting systems. Said to require no maintenance or lubrication; anti-backlash slides can be manufactured in lengths up to 8'.

Kerk Motion, www.kerkmotion.com 

The Arlink 8000 modular workstation can be configured in a variety of heights and lengths. Comes in five industry standard widths and three different heights up to 84". Has “starter and adder” system, with the option of back-to-back configurations; said to have unlimited layout possibilities. The Definite Positioning System enables relocating or adjusting work surfaces, storage, shelving, lights, power beams, footrests, etc. Is available in standard laminate or static dissipative.

Lista International Corp., www.listaintl.com

Advanced Telecommunications Computing Architecture Zone 1 backplane power connectors are specified by PICMG 3.x open standards. Are comprised of eight size 16 contacts and 22 size 22 contacts. Use gold-over-nickel plating at the contact interface, and tin or gold plating on the PCB terminals. Insulation body has integrated guiding feature. Contact terminals provide compliant press-fit zones that are flat-rock compatible. Connector is RoHS compliant. Features include dual-48VDC power distribution feeds; up to 16A per power pin; four level sequential pins for hot swapping; alignment features for blind mating, and press-fit termination. Supports full-mesh and dual-star configurations.
 
Yamaichi Electronics, www.yamaichi.com

Thermal transfer ELP printers include three models with three dpi formats: 220, 320 and 620. Are said to deliver durable print-head performance and print small labels. The ELP620 has micro-miniature printing capabilities. All are said to be functional, easy-to-use and easily maintained. Additional attachments can be integrated. Come equipped with multiple connection capabilities, including serial, parallel, USB, Ethernet and wireless. Have standalone mode.

Identco International, www.identco.com

Mixpac Equipment Inc., www.mixpacequipment.com

The Hot-Bar reflow desktop soldering system has pneumatic force adjustment available with a SH500 bonding head. Replaces spring technology and is said to cover a range up to 500N. Force is set by a manual knob; displays set range on a digital screen on the head. Typical joining applications include flex to PCB, wires to PCB, ribbon cables, and SMT components.

Miyachi Unitek, www.muc.miyachi.com

These three pick-and-place machines offer head-mounted cameras and Cognex processing for non-contact vision placement of 0201 chips to 16 x 14 mm SMDs and fine-pitch QFPs. Include a bottom vision camera for larger components to 38 x 38 mm. Said to have placement accuracy of ± .002" (± .05 mm) by linear-encoded X-Y drive mechanisms. Reportedly have availability of advanced time pressure digital dispensing for application at dot sizes down to 0.015 mm diameter. Use MC-300 Series control software. The MC-384 has a single head and a reported placement area of 14.5" x 13.4" for a capacity of 128 smart tape feeders. Its throughput is 4,000 cph. The MC-391 includes a three-stage conveyor and is said to have a speed of 5,500 cph on a large 14.75" x 23.4" placement area that can accommodate 160 tape feeders. The MC-387 has a 39.4" x 12" work area; can contain 224 smart tape feeders. Placement speed is said to be 5,500 cph.

Manncorp, www.manncorp.com