NexJet system jetting technology contains Genius jet cartridge, a one-piece jet removable without tools. Has built-in memory to store usage data such as number of cycles and cartridge type. Includes software control of jetting process; accommodates both low- and high-viscosity fluids and a range of fluids for applications such as flip chip underfill, chip-scale package, ball grid array, package-on-package underfill, precise coating, and adhesive dispensing. Cartridge dispenses up to 50 million cycles before replacement is necessary, depending on application. Memory stores usage data that is communicated to dispenser; notifies operator when correct cartridge is installed or needs replacement.

Nordson Asymtek, www.nordsonasymtek.com

No. 959 is a 300ºF electrically-heated vertical conveyor oven used for curing electronic parts. Dimensions measure 36" x 89" x 115". Uses a 40KW heating element and a 6000 CFM, 5-HP recirculating blower. Features 4" insulated walls, aluminized steel interior and exterior, motor-operated vertical lift door at the loading/unloading opening and two independent doors. Includes 27 product carrier trays, each 30" x 14", supported at each side by a roller chain, driven by a ½-HP drive motor, controlled by a variable frequency drive. Controls include a digital temperature controller, manual reset excess temperature controller with separate contactors, recirculating blower airflow safety switch, and a tower light to indicate machine status. Built to JIC/NEMA 12 standards. 

The Grieve Corp., www.grievecorp.com

DB-1590 is a solder replacement in for crystalline silicon solar modules using thinned silicon or plated bus bars. Is optimized for conductivity and stability on various substrates when cured at 200°C. Is said to gel in 5 sec. or less at 200°C, developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. Rheology optimized for dispensing, damp heat resistance and conductivity stability on tin, SnAg and Ag-plated ribbons. Is stable on OSP treated copper and nickel bus bars.

Engineered Conductive Materials, www.conductives.com

Novagard 800-230, 800-305, and 800-400 UV curable staking compounds are used as conformal coatings, potting compounds, inks, encapsulating and gasketing compounds and gels. UV 800-230 fast UV curing, single-component sealant is solvent-free; exhibits controlled rheology, no oxygen inhibition, has no corrosive byproducts, and cures quickly to solid rubber with UV irradiation at room temperature. UV 800-305 UV/dual cure sealant and adhesive is a noncorrosive, single-component silicone translucent paste sealant; cures to a solid rubber at room temperature. Exhibits controlled rheology and no oxygen inhibition. RTV 800-400 UV cure sealant is a noncorrosive, single-component silicone translucent paste sealant.

Novagard Solutions, www.novagard.com

Miniko benchtop screen printer features a 23"standard screen frame format; closed loop servo motor control throughout print cycle; a graphical user interface with touch screen control, and optional twin camera vision system. Provides programmable print parameters, including printing speed and pressure; programmable board from stencil separation speed and distance; twin squeegee printing with independent control of printing pressures, and motorized control of all stages of the printing process. Product files can be saved to removable Micro SD flash card. Optional vacuum tooling available. Provides double-sided printing and borderless printing on substrates up to 450 x 460mm.

Reprint, http://www.reprintservices.co.uk

vVision AOI software verification station displays defect images and features. AOI results are verified and an evaluation is made. Inspection data can be used for various evaluations, including statistical process control. vVerify customizes configuration of the displayed information regarding selection and positioning of the additional images. Ninety-five percent of defects can be directly classified with the defect image transferred from the AOI without reference to actual board. In ValidCompareMode, a previously validated good image is offered for comparison to each defect image. Defect location and additional information can be displayed on a second monitor or through the shift key.

Viscom, www.viscom.com

This inline board cleaning and defluxing system for water-soluble fluxes accommodates PCBs up to 24". Measures 12½ ft. long. Has a 60° angled nozzle directing spray under the components for removal of all water-soluble flux residues. Has high-performance stainless steel spray pumps and a turbine-powered rotating air knife, working with fixed-position air knives. A rinse water closed loop recycler is available for zero discharge operation. 

Manncorp, www.manncorp.com

Pressure Decay Leak Test Calculator is automated and generates nearly instantaneous answers to “what if” modeling of pressure decay leak testing variables from 8-sensor concurrent leak testing technology. Variables that can be manipulated include pressure ranges; leak rate target; number of concurrent pressure decay sensors in use (up to 8 with Optima vT leak and flow tester); customization of test cycle times, including all stages of fill, stabilization, test time, and total, and part/test volume.

USON, Calculators@uson.com

535-10M UV cured epoxy is formulated for disk drive, camera module, optoelectronics and circuit assembly applications. Non-conductive adhesive cures rapidly when exposed to high-intensity UV light. Is low outgassing, flexible, high-strength; does not contain antimony. 

Engineered Material Systems, www.conductives.com

Shrouded male pin connectors are for frequently mated interconnects and blind mate conditions. Double row connectors come in 4- to 64-pin configurations, in through-hole and surface mount termination styles. Shroud extends above pins to limit misalignment between connectors during mating and de-mating. PTH and SMT versions are dual-row with 0.100" spacing pin-to-pin and row-to-row. Connector body is molded from high-temperature thermoplastic with thermal stability, chemical resistance and flammability rating of UL94 V-0. Pins are made from precision-machined brass. Engaging leads are 0.030" in diameter, 0.142" long and gold-plated. Are RoHS compliant and suitable for Pb-free reflow. 

Mill-Max, www.mill-max.com

357-348 wire bond encapsulant and flexible circuit bonding adhesive is for circuit assembly applications. Protects wire bonds and reduces stresses associated with thermal cycling. Reportedly is chemically resistant to inks. Has high fracture toughness and adheres to flexible circuits, FR-4 and metal substrates. Meets ionic cleanliness standards.

Engineered Material Systems, www.conductives.com

Production Runner PCB production line is designed for high-mix, low-to-mid-volume automated assembly; is suitable for both short and long runs. Includes dual-head 8,000 cph MC-385V2V pick-and-place, 5500 dual squeegee stencil printer, and CR-4000C Pb-free hot air convection reflow system. MC-385 accommodates 128 smart tape feeders and includes Cognex on-the-fly vision that aligns standard and odd-form SMDs, providing a placement range from 01005s through 100mm x 150mm connectors. 5500 stencil printer features vertical lift and the ability to process double-sided boards. CR-4000C reflow has a 16" pin conveyor over a 20" stainless steel mesh belt; includes KIC Auto Focus Power process automation software.

Manncorp, www.manncorp.com