EPM1-2493 low-viscosity, low modulus silicone elastomer has a nominal thermal conductivity of 1 W/mk. Offers bond lines as thin as 5 microns. Adheres materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. Reportedly reduces or prevents contamination of electronics components in applications exposed to high heat, such as solder reflow at 260°C. Adheres to aluminum, and with a primer achieves average lap shear values of120 psi (0.8 MPa). Is a pourable, conformal liquid for potting/filling recessed areas. Can be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material. Comes in a 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. Cures at lower temperature but can be heat-accelerated for faster cure time.

NuSil Technology, www.nusil.com

ROI Calculator determines the cost of performing rework and repairs associated with solder contamination in wave solder operations. Determines amount of defects. Input data for shifts, days and working weeks per year.

Solderlab.com, www.solderlab.com/cost_of_rework

SFX5212 I/O module provides independently programmable I/O channels, and reportedly processes voltages up to 30V. Increases test coverage for non-boundary scan circuits or peripheral signals with higher signal voltage by combining structural and functional test procedures on a single platform. In addition to increasing test quality, test costs can be reduced by saving separate process steps.

Goepel Electronic, http://www.goepel.com

DDF Innova Direct Die Feeder converts Assembléon’s pick-and-place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. Conversion permits controlled die bonding speeds up to 15,000 components per hour at maximum accuracy, and passive component placements up to 121,000 cph. Handles system-in-package, multichip module, flip-chips and embedded passive and active components. Supplies bare die directly from up to 300mm (12") wafers in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine.

Assembléon, www.assembleon.com

UV15 is used for bonding, coating and sealing. Is a 100% reactive epoxy-based UV curable material. Contains no solvents nor other volatiles. Is free of oxygen inhibition. Cures quickly when exposed to UV light with a wavelength range between 320nm and 365nm. Typically cures in thicknesses of a few microns to 0.015-0.020 in. in 15 to 30 sec. or fewer. Cures by a cationic reaction and produces bonds that reportedly have lower shrinkage (1-2%) and higher temp. resistance than most UV systems. Tg is 90°-95°C with a straight UV cure. When post-cured for 30 min. at 125°C, Tg is 125-130°C. Service temp. range is -80°F to +350°F. Resists chemicals, including water, acids, bases, fuels and many solvents.

Master Bond, www.masterbond.com

Arduino Prototyping Shield for surface mount prototyping use novel "EZ" soldering technology for fast and easy soldering.

ezLOAD PCB support system for MPM SPM screen printers is built for batch printing and prototype work. Features machined base plate and soft, ESD-safe foam fingers. ezLOAD PAD features active grip technology to hold boards during the screen printing process; is ESD-safe. Is compatible with any SMT equipment, from pick-and-place to chip shooters, screen printers, dispensers, and AOI equipment. Is customizable.

Count On Tools, www.cotinc.com/ezload

D9600 C-SAM is a general-purpose system for laboratory/failure analysis work or for low-volume production inspection, including software and hardware upgrades. Has a linear motor x-axis scanner that leverages Gen6-style technology. Can select image resolution based on desired pixel spacing, down to 1µm, for the size scan desired. Includes Sonolytics operator interface. PolyGate technology is designed for optimizing imaging at multiple levels simultaneously. Visual PolyGate permits the operator to see all the gates (slices of time/depth to be investigated) chosen for each level of interest within a sample in a dual A-Scan display format. Each gate yields its own image. Permits the capture of up to 100 gates per channel during a single scan. Results can be turned into a 3D volumetric model. Can diagnose features within typical microelectronic samples, such as plastic-encapsulated ICs.

Sonoscan, www.sonoscan.com 

800 large format automatic optical inspection system is for printed circuit board assemblies up to 21.6" x 31.5". Offers full-color inspection. Has short programming time and combined pattern matching and condition-based AOI algorithms; has high throughput with excellent defect capture and low false calls on solder paste, components, and solder fillets. THT inspection algorithms allow for 100% inspection of through-hole component leads. Includes telecentric primary lens with the option of up to eight additional cameras for angled inspection, RGB lighting, and through lens illumination. Bench-top and inline versions are available.

MEK/Marantz, www.escapethegreyworld.com

Agilent N6462A DDR4 compliance test application is for systems using double-data-rate 4 memory. Can accelerate turn-on and debug of DDR4 systems by automating the execution of physical layer tests. Uses four high-bandwidth oscilloscope channels. DDR4 dynamic random-access memory technology with high-bandwidth interface operates at a max. of 1.2 volts and can achieve a data transfer rate of up to 3.2 giga transfers per sec. Is designed for high-end computing applications. Application provides automated clock, electrical and timing tests. Automatically configures oscilloscope for each test and generates an HTML report at the end of the test. Report compares results with specified test limit and indicates how closely the device passes or fails each test. Can debug signal integrity issues using N6462A software in conjunction with InfiniiScan multichannel and multizone triggering features.

Agilent Technologies, www.agilent.com

PC003 solder practice kit is IPC-A-610 compliant. Is for training and testing employees. Double-sided PC board has pads for 13 different components: one through-hole dip14 and 12 surface-mount components. Each item is individually bagged and tagged. Consists of PLCCs, SOICs, TSSOPs, SOTs, passives, and QFPs with 0.5mm and 0.65mm pitch. Is for classroom training and practice.

Practical Components, www.practicalcomponents.com

PC015 rework kit conforms to IPC-7711/7721 standards. Is for rework training or to evaluate current rework procedures. Contains two fully populated boards and enough components to repopulate the boards after the removal of components. Contains a range of components from through-hole to chip scale. Is boxed with all components individually bagged and labeled.

Practical Components, www.practicalcomponents.com