DataMan 300 barcode reader now includes liquid lens optics. Can now upgrade from fixed focus to autofocus. Liquid lens variable autofocus technology is reportedly ideal for applications that require a large depth of field or when refocusing is needed after a product changeover. Intelligent tuning feature automatically selects optimum settings for the integrated lighting and for autofocus optics for each application. Liquid lens can be adjusted with software or serial commands without touching the reader. DataMan 300 has a resolution of 800 x 600 pixels; DataMan 302 has a resolution of 1280 x 1024 pixels.

Cognex, www.cognex.com

M.O.L.E. MAP 3.00 software is designed for machine-assembly-process optimization. Switches from one application to the next, transitioning between wave soldering and reflow processes. Integrates with all ECD profiling hardware. Can use ECD sensor inputs to ECD M.O.L.E. thermal profilers. Start wizards provide step-by-step guidance for new process development, existing process adjustments, data downloads and process verification. Navigation and file sharing enable links to previous sessions, multi-profile sharing through a bulk import feature, and report distribution via PDF or e-mail. Target-10 functionality provides “go/no-go” result indication, intuitive data interpretation, and deep drill-down data. M.O.L.E. and RIDER pairings separate one profiling data acquisition activity from another for environment- and application-specific information.

ECD, www.ecd.com

ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas Instruments processors. Software improvements include: Separate global and local constraint entry within the ScanExpress TPG preparation GUI; inverted transparency model support along with a new constraint to identify inverted nets; ability to associate multiple BSDL files to a single JTAG device; NAND Flash bad block management support in ScanExpress JET; optimization of STAPL file execution for improved throughput.

Corelis, www.corelis.com

OptiCon THT-Line AOI now can be directly integrated in the production line. Carriers sized up to 620 x 510mm can be fed into the system. PCB inspection area is 540 x 410mm at a component height up to 80mm. Inspects through-hole assemblies, including polarity check of electrolytic capacitors and OCR label reading.

Goepel Electronic, www.goepel.com

Sarcon 25GR-T2d conformable thermal interface medium is for low and high-volume production applications. The reinforced 0.25mm thick TIM is for tight tolerance die-cut operations. When placed between a heat source and a nearby heat sink, gap filler pad provides a thermal conductivity of 1.5 W/m°K and a thermal resistance as low as 0.33 °Cin²/W. Handles operational temperatures between -40°C and +150°C. Comes in pre-cut sheets up to a max. size of 200mm x 400mm.

Fujipoly America, www.fujipoly.com

Rapido multisite inline programmer is for high-speed in-system programming of non-volatile memory devices such as Flash, serial EEPROM, micro controller units and programmable logic devices. Provides double-sided probing with up to 900 nail probes and gang programming of up to 16 sites. Available applications include FPGA-assisted programming, core-assisted programming through a JTAG or non-JTAG debug interface of a processor, in-application programming, and programming via boundary scan. Targets for programming applications are NOR, NAND, and eMMC with parallel or serial interface, as well as on-chip memory on microcontrollers and PLD and FPGA devices. Options can be added to incorporate board test applications, to accommodate extensions, to program through CAN, LIN or FlexRay interfaces, and for communication with pick-and-place feeders and with PASS/FAIL sorters, for example. Is based on Scanflex.

Goepel electronic, http://www.goepelusa.com/

iHawk Xpress has an improved transport to handle lead frames up to 100mm wide. Bonding accuracy improved to 3µm, and novel GoCU technology enables faster operation with copper wire. Ensures bonding wire is clamped in place and automatically rethreaded after a break, minimizing downtime and improving productivity.

ASMPT, www.asmpacific.com

OptiCon XI-Pilot 3.0 x-ray inspection system software enables higher image recording speed at increased sensibility. Compensates for PCB warpage or automatic stability control of image sequence. Detects and compensates PCB slag during inspection, for true to height solder layer reconstruction. Determines whether entire assembly or each partial circuit of a value should be compensated. Uses laser triangulation sensor determine PCB warpage. Compensates for PCB slag directly in the recorded images using software algorithm. Automatically detects changes in x-ray image chain and recalibrates images chain at lower deviations of acceptable tolerances. Reportedly ensures image geometry characteristics as well as intensity (grey values) are situated in an adjustable tolerance range.

Goepel Electronic, www.goepel.com

OptiCon SPI-Line 3D solder paste inspection system is offered in three different configurations determined by pixel resolutions of 10µm, 15µm and 20µm. Has inspection speed up to 90cm². Is fully compliant to all OptiCon AOI systems. Has a 3D camera head functionally based on fringe projection principle, operating without moving parts. Includes newly developed user interface SPI-Pilot. Offline programming station and module for statistic process control evaluation are offered as add-on options.

Goepel electronic, www.goepel.com

C-Class Cleaner Series PS300 includes -VL, -VS, -HD, and -CA, featuring PowerSpray technology. Is automatic and 90 x 120 x 160cm (without status light bar). Is for small to medium cleaning quantities. Operates in a closed loop system without water or water disposal connection with a two tank system using TernarySequence, a water-based detergent and an integrated cascade sediment filtration. Features include a combination tank system with one communicating detergent; product handling capability of 780 x 950mm; PLC controlled process time and filter saturation, and stainless steel construction with all process sections made of electrolysis-resistant materials.

Kolb Cleaning Technology, www.kolb-ct.com/en/

YSI-X 3D x-ray is for 100% inspection of onboard automotive products and other items. Standard features include x-ray, optical, infrared and laser height measurement. Comes in three types, with minimum resolutions of 3, 7 and 18 microns. Automatically generates inspection unit data using Yamaha placement equipment data. Auto-corrects for PCB warpage using x-y-z fiducial data. Digital laminography (planar CT) makes composite of multiple x-ray images and captures a horizontal cross-sectional slice at optional height.

Yamaha Motor IM, www.yamaha-motor-im.com

ChipVORX FPGA-based I/O modules are controlled via a standard TAP enabling access to the entire ecosystem of test and programming IPs for external instrumentation. FXT-X90 module is based on a Xilinx FPGA, providing 90 I/O channels, whereby 72 are voltage programmable. Is equipped with a transparent TAP; enables daisy-chained cascading of several boards of the same or different types. Various functions for universal frequency measurement, RAM test, fast Flash programming or control of instruments are provided as IP. Provides a separate clock generator. Can be applied as a boundary scan I/O module with dynamic mode switching capability. Is supported by Scanflex boundary scan controllers System Cascon software.

Goepel electronic, www.goepel.com