AR4HT series CSP sockets accept any area-array device for high-temperature testing up to +200°C. Incorporate a low-profile 0.45mm contact structure (compressed) that is shorter than other low-profile contacts. Provide compliance for reliable ATE testing and burn-in. Accommodate BGA, LGA, QFN, DFN, CSP, MLCC and PoP, as well as bumped die with full and partial arrays. Full socket operating temperature is -55° to +200°C, with a life expectancy of more than 10,000 actuations. Socket can accommodate IC devices with a pitch of 0.4mm or greater, as well as mixed pitch environments. Interposer set is comprised of silver particles within a silicon elastomer with a polyimide core. Initial contact force is 20 to 30gm per lead. Available in custom sizes.

Aries Electronics, www.arieselec.com

2600-093 Micro-Kiss series mix-dispense valves are designed for low-flow mixing and dispensing of two-component adhesives and sealants, such as silicones, epoxies, urethanes and acrylics. Are used to apply two-part adhesives and sealants for bonding, gasketing, potting and filling processes. Are based on Micro-Kiss No-Drip valve body design for low-flow fluid control using bayonet-style static mixers. Integrate carbide ball-end needles with carbide seats. Have individual actuator valves for Part-A and Part-B materials. On-off actuation of the valves provides controlled flow of each fluid component into the mixer; ideal for mix ratios wider than 1 to1. Are double air actuated for 4-way pneumatic valve connections.  

Sealant Equipment & Engineering, www.sealantequipment.com

NXTP-M25 screen printer has two lanes for increased throughput and changeover. Features one-sided operation and the ability to place machines back-to-back. Mask accuracy reportedly is ±10 um. Features low-impact clamping to reduce warpage when panel is clamped. Optional automatic solder supply method minimizes waste.

Fuji Machine Manufacturing Co., Ltd., fuji.co.jp

NXTP-M25 screen printer has two lanes for increased throughput and changeover. Features one-sided operation and the ability to place machines back-to-back. Mask accuracy reportedly is ±10 um. Features low-impact clamping to reduce warpage when panel is clamped. Optional automatic solder supply method minimizes waste.

Fuji Machine Manufacturing Co., Ltd., fuji.co.jp

DataMan 8000 series wireless handheld industrial ID scanner comes with extended range cord-free code reading applications. Communicates via EtherNet/IP, PROFINET, MC Protocol and others, in addition to traditional support for USB and RS-232. Supports industrial protocols for both corded and cordless models. Provides a working range of up to 100m, with a large memory capacity for reading codes when offline or out-of-range. Read every type of code. Offer liquid lens variable focus technology; can read small 2-D direct part marks and long linear 1-D barcodes. 8100 model has bright field illumination.

Cognex, www.cognex.com

Stingray tabletop x-ray inspection system features a cross laser mark to help position test sample. Digital x-ray film measures 36.5 x 25.8mm and resolution is 1916 x 1358 pixels. Features selective enlargement, contrast optimization or grayscale-to-color conversion. Features onscreen measurement of distances and angles. Measuring chamber is easily accessible from front. Runs on Windows 7. Weighs less than 100 kg. High-voltage peak 60-70 kV, ensuring minimum power consumption and maximum security.

Essemtec, www.essemtec.com

Stellar IP automates FPGA image creation by reusing proven IP cores. Creates new FPGA designs by relying on existing IP; extends domain of influence to entire system. Simplifies the integration of new cores that can be reused across multiple designs. Provides a library of off-the-shelf IP cores and automates the creation and compilation of ISE projects, in addition to simulation scripts. Knowledge of HDL language not required.

4DSP, www.4dsp.com

Ecoselect 1 selective soldering system requires less than 3m² of space. Is semiautomatic; uses same technology as Versaflow system. Can handle printed circuit boards sizes up to 406 x 508mm. Includes spray monitoring and continuous pressure monitoring of the flux storage tank. Is equipped with a full-area preheater. Bottom-side heating consists of eight emitters that can be switched in groups to match their power with the assembly’s heat requirements and size. Has universal pallet conveyor; fluxer module with precision spray fluxer; bottom-side preheating via short-wave, dynamic IR emitters; top-side convection heating; Pb-free single point solder module; second solder pot to process two different solder alloys; second solder pot to process multi-up panels; camera/screen for solder process monitoring; barcode scanner; CAD data download of board layouts; operation via touch panel; traceability according to ZVEI standards, and fiducial recognition standard/option.

Ersa, www.ersa.de

Ecoselect 1 selective soldering system requires less than 3m² of space. Is semiautomatic; uses same technology as Versaflow system. Can handle printed circuit boards sizes up to 406 x 508mm. Includes spray monitoring and continuous pressure monitoring of the flux storage tank. Is equipped with a full-area preheater. Bottom-side heating consists of eight emitters that can be switched in groups to match their power with the assembly’s heat requirements and size. Has universal pallet conveyor; fluxer module with precision spray fluxer; bottom-side preheating via short-wave, dynamic IR emitters; top-side convection heating; Pb-free single point solder module; second solder pot to process two different solder alloys; second solder pot to process multi-up panels; camera/screen for solder process monitoring; barcode scanner; CAD data download of board layouts; operation via touch panel; traceability according to ZVEI standards, and fiducial recognition standard/option.

Ersa, www.ersa.de

MC385V1V has a speed of 5,000 cph and features placement accuracy of 30 µm @3 Sigma. Has a vibration-free, rigid unibody steel frame, ball screw X-Y drive and linear encoders with high-speed servo motors. Cognex on-the-fly and upward-looking vision is standard for a placement range of 01005s to 150 x 100mm devices. Has 128 smart feeder capacity. Boards of up to 435mm x 340mm can be accommodated. Dual-head version has speed of 8,000 cph. Is compatible with MC384 placement machine.

Manncorp, www.manncorp.com

FIS Track and Remote modules interface with external software systems like MES (Manufacturing Execution Software). Enable automated collection and export of programming results, to support traceability, reduce risk of recalls and minimize scrap. Provide remote control of programming commands, eliminating operator errors related to job selection and downloads, and ensuring that the correct data is programmed into the correct device on each line.

Data I/O, dataio.com

FIS Track and Remote modules interface with external software systems like MES (Manufacturing Execution Software). Enable automated collection and export of programming results, to support traceability, reduce risk of recalls and minimize scrap. Provide remote control of programming commands, eliminating operator errors related to job selection and downloads, and ensuring that the correct data is programmed into the correct device on each line.

Data I/O, dataio.com