Alpha Telecore HF-850 halogen-free cored solder wire developed to comply with IEC, JPCA and Jedec halogen content specifications. Is said to wet quickly with low flux spatter and low levels of fumes. Provides good spread characteristics that improve first pass yield. Is for use in any commercial no-clean soldering application. Leaves a clear, non-tacky residue does not require cleaning. Comes in SAC 305 and SACX Plus 0307 alloys.

Alpha, www.alphacpmd.com/Products/Cored-Wire/Telecore-HF-850

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ii-Feed tape feeder has a capacity up to 33 separate component channels and accepts any mix of 8, 12, 16 or 24mm smart "elements." Elements provide part recognition, internal memory, auto adjustment of pick-up offset, programmable tape pitch in 2mm increments, and reel batch ID. Has a component range beginning at 01005. Is compatible with previous machine generations. Operates in three different modes: wired/wireless micro terminal, programming ii-elements separately offline, and with or without stock management options. Same type of element can be used for tapes (paper and plastic), full reels or short tapes. Data are automatically recognized. Reels can be prepared offline in magazines for up to 11 references; the cart can receive three magazines. Elements can be stored with reels in passive shelves.

Europlacer, www.europlacer.com

SFX/WSL1149-(x) boundary scan controller provides a triple stream/bual band wireless interface for theoretical transmission speed up to 450Mbps, enabling wireless utilization of the newest embedded system access (ESA) technologies for testing, programming and debugging complex chips, printed circuit boards, and systems.
Is compatible with IEEE standard 802.11a/b/g/n. Provides USB2.0 and Gbit Ethernet interfaces. Includes three models of different performance classes to be configured by software, enabling TCK frequencies of up to 80MHz. Can be configured with up to eight independent parallel TAPs and up to 31 additional analog or digital functional modules.

GÖPEL Electronic, www.goepel.com

N=1 Checker first article test system is prototype, high-mix/low-volume, and pre-production applications, component revision verification and production changeovers.
Test Program Generator software automates programming so untrained operators can use the system. Performs high-speed automatic impedance measurement for resistance and capacitance combined with a visual inspection system to verify component type, orientation, text, angle, presence and absence. Automatically records all data, which can be exported to user database and process control software programs.

Newly Tsuchiya, www.tsuchiya-group.co.jp

CGI Americas, www.cgi-americas.com

JM-10 is for radial and axial component mounting. Feeders are compatible with all Juki machine types. Has a footprint of 1.5m. Components do not experience mechanical wear. During component measurement, body dimension is checked, and every lead is inspected. Twisted leads are recognized by the system; the affected component is not selected for assembly. Vibrating bowl feeder has capacity for up to six different components; each machine can place a max. of 12 different bulk components. For taped components, radial feeders are available. Between seven and 10 feeders can be set at the front or the rear of the machine. Can handle a mix of THT and SMT components. For QFPs, it provides vision centering with a 54 or 27mm view field.

Juki, www.jukiamericas.com

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Master Bond LED401 adhesive, sealant, coating and encapsulant cures tack-free under exposure to a 405nm wavelength light source, without any oxygen inhibition. Is for applications involving heat-sensitive substrates. Viscosity is 100,000-150,000cps. Has cure times of 15 to 30 sec. or fewer in thinner sections; can be readily cured in sections up to 1/8 in. thick. Offers resistance to water, many acids, bases and oils. Has a volume resistivity exceeding 1014ohm-cm and a temperature range of -60° to +250°F. Has a shelf life of six months at room temperature without exposure to light, in its original containers.

Master Bond, www.masterbond.com  

MT8870A universal wireless test set has test capability for up to eight user equipment devices in a single mainframe without the need for external switching. Basic module includes an integrated vector signal analyzer, vector signal generator, and multi-core processor. Can configure a mainframe with up to four modules with four VSAs and four VSGs. Implements test capabilities for multiple formats through the addition of VSA and VSG software options, with current support ranging from Bluetooth and Wi-Fi to LTE and 802.11ac. Can be configured with one to four VSA/VSG modules, supporting 10 MHz to 6 GHz, as well as the 160 MHz bandwidth. Each module has two duplex and two simplex RF connectors. GPIB and Ethernet control of the VSA/VSG modules are available.

Anritsu Company, http://www.anritsu.com/en-US/

X8011 PCB comes with a link to the verification station for ease of analysis. Unspecified defects can be automatically pinpointed and re-examined in detail. XMC analysis software allows convenient operation, containing several automatic analyses such as BGA, QFN and inspection, and void calculation. The verification terminal link is identical to the inline system’s. All data and images of the type of defect can be stored and called up over the traceability system. Defects that evade conclusive identification can be directly and automatically pinpointed for detailed examination; i.e., with an inclined view or zoom enlargements.

Viscom, www.viscom.com

ABI Sentry counterfeit IC detector uses a combination of electronic parameter settings (voltage, frequency, source resistance and waveform) to generate a PinPrint for each pin of the IC being checked. Compares electrical signature of known components with suspect components. Can detect missing or incorrect dies, lack of bond wires, inaccurate pin-outs and pin impedance variations. Pass or fail results are returned after testing. Device library can be built by adding specific known good devices. Each device can have documents associated with it, such as photos of device markings and data sheets. Contains hardware required to analyze electrical characteristics of ICs with up to 256 pins. 256 pins+ devices can be tested by rotating the device (BGA, QFP) to permit all pins to be learned and compared. Is supplied with four 48-pin dual inline zero insertion force sockets. Weighs 8 lbs.

Saelig Co., www.saelig.com

FactoryLook 6.0 provides a scalable enterprise manufacturing intelligence platform. Is capable of managing all equipment operations and all workflow processes required for manufacturing operations. Open architecture offers access to data and enables communications and data flow between internal and external systems. New features include management of large volumes of complex data; Manufacturing Intelligence is actionable in real-time; equipment and recipe management tools; multiple views into interactive dashboards; roles-based dashboards for operations management, and brand integration with PLCs, SCADA, and DCS equipment.

Vistrian, www.vistrian.com

VT-RNSII inline post-reflow inspection system and VT-RNSII-ptH benchtop model now have faster shutter speeds and improved image processing to perform inspections 20% faster than the original series. Use Color Highlight system that provides 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera system enhances solder shape recognition accuracy. Offer resolution of up to 10µm; support inspection of components as small as 01005 and 12 mil pitch. Optical Character Verification capability is standard. Have EzTS program generation software. Include models for paste inspection and pre-reflow component placement inspection.

Omron, www.omron247.com

ScanVision tool suite for boundary scan design visualization performs multi-board design visualization at the layout and schematic level. Consists of Layout Visualizer, Schematic Visualizer and Virtual Schematic Visualizer. Database is generated by importing individual design data and interconnection referencing. Tools include Cascon Board Merger and Cascon Component Explorer. Performs interactive cross-probing between schematic and layout, selective labeling of pins, components and circuits, and tracking of signal paths via multiple boards with dynamic switching. Enables operations such as test coverage analysis, hardware debugging or graphical fault display far above the board boundaries up to system level. Has System Cascon v. 4.6.1.

Goepel electronic, www.goepelusa.com