Wizard stencil storage racks hold stencil foils and frames designed for electronics materials printing. Provide safe storage using injection-molded guides at the top and bottom, and quick access from either side. Are rugged and durable, compact and space-efficient. manufactured using extruded aluminum. Mounted on locking casters for mobility. A 20” x 20” rack holds 300 stencils in 2’ x 5’ of floor space. Configurable to hold several vendors' frames.

QTS, Inc., www.QTSframe.com

Fast-curing CA-141 conductive adhesive is for stringing and bussing CIGS solar modules. Has been optimized for molybdenum and other substrates used in thin-film manufacturing. Is designed for thermal cycling and damp heat stability. Low Tg is suitable for manufacturing flexible modules using reel-to-reel manufacturing. Can be partially cured for 60 to 90 sec.; adhesive cure is completed during encapsulant lamination process. Reportedly has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.

Engineered Conductive Materials, www.conductives.com

WXD 2 is a two-channel, 255W soldering and desoldering station. Features desoldering tool with 120W of power, a 35-sec. heat-up time, replacement filter cartridge and nozzles with extended shafts. Standby mode monitors motion sensor and automatically sets pencil to lower temperature when not in use. Nozzles have extended thermal transfer shaft that prevents suction tube from sticking. Has standard power-sharing feature. Preheating plate or solder fume extraction unit can be connected.

Weller, http://www.apexhandtools.com/weller 

PNA-X network analyzer now has source-corrected noise-figure measurement capability of 43.5 and 50GHz. Provides a single-connection, multiple-measurement capability for R&D and manufacturing engineers developing and testing low-noise transistors, amplifiers, frequency converters and transmit/receive modules. The 50GHz noise hardware features a built-in low-noise receiver and impedance tuner. Network analyzers combine S-parameter vector-error correction and an impedance tuner to remove the effects of imperfect system source match.

Agilent Technologies, www.agilent.com 

HP-520SPI is closed-loop solder paste inspection system that provides real-time measurement and control of solder paste. Automatically adjusts squeegee pressure and speed, initiates screen cleaning sequence, and stops production if a PCB cannot be brought into programmed specification. Three-stage automatic conveyor buffers printed circuit boards on entrance and exit. Features edge clamping; programmable control of squeegee pressure during print stroke; servo-controlled support table.

SJ Inno Tech, www.sjinnotech.com

Thermoset UR-288 urethane encapsulant cures at room temperature to produce a flame-retardant, semi-flexible material. Exhibits low shrinkage and stress on components as it cures, and maintains a low viscosity that reportedly achieves complete, void-free encapsulation. Suitable for curing at room temperature. Produces low exothermic heat rise during cure.

Lord Corp., lord.com/electronicmaterials

ezLOAD PCB support system for EKRA screen printers features precision machined aluminum base with magnetic supports and soft, ESD-safe foam fingers. Is said to reduce changeover times and improves product build quality. Features active grip technology to securely hold boards during screen printing process and is ESD-safe. Requires no air, electronics or communication from the user. Is said to be compatible with any SMT equipment, from pick-and-place to chipshooters, screen printers, dispensers, AOI equipment and more. Customizable.

Count On Tools Inc., www.cotinc.com/ezload

Two OpenSCAD source files for designing a resistor lead forming tool. Bends resistor and diode leads uniformly and consistently. Files come in the following styles:

• Metric: lead spacings in increments of 2mm; imperial: lead spacings in increments of 0.05".
• Narrow: for small resistors with bodies no longer than 6.75mm (0.25"); wide: for medium resistors with bodies no longer than 10.50mm (0.40")
• Long: a long tool with lead spacings up to 40mm (1.5"); short: a shorter tool with lead spacings up to 30mm (1.0").

Files are fully parameterized, making it easy to change the increments, dimensions, spacings, widths, etc. of the tools by editing the files and re-rendering the tool.

Thingiverse, www.thingiverse.com/thing:26025

MX-5200 soldering, desoldering and rework series has dual-simultaneous ports. Two hand-pieces can work from one power supply at the same time. Dynamic option enables the two hand-pieces to share 80 watts output power. Includes four different hand-pieces and soldering and rework cartridges, including Advanced Hand-Piece for SMD rework, Ultra-Fine Hand-Piece for fine access, a Precision Tweezer capable of removing components from 0201 chips to 28mm SOICs, and a Desoldering Gun for removing through-hole components.

Metcal, www.metcal.com

PCB Magnetic Support Pins for Ekra screen printers are precision-machined from stainless steel and feature a strong magnet for secure operation. Guaranteed to be functional with the equipment and provide durability throughout production.

Count On Tools, www.cotinc.com

Tilt NPI Tester is capable of testing printed circuit board assemblies up to 25" x 31" with up to 10,000 nets. Fixtures and test programs average 33% of the cost of conventional ICT; reportedly can be delivered in less than half the time normally required for conventional ICT programs and fixtures. Has ability to test 0.015" targets on 0.024" spacing. Backplanes also can be tested.

Everett Charles Technologies, www.ectinfo.com

TS9000 Series is a Piezoelectric-driven, non-contact Jet Tech valve. Handles fluid viscosities to 2 million Cps. Produces hundreds of deposits in less than one sec. Has adjustable parameter settings and a variety of nozzle shape and sizes, with different tappet configurations. Features field replaceable spare parts. Applications include jetting silver epoxies for die bonding processes, silicone phosphor in the LED assembly process, underfill in microelectronic package applications on PCBAs, and micro dots of UV adhesive in medical device applications. Is shipped standard with a valve, controller, cables and three nozzle tools.

Techcon Systems, www.techconsystems.com