FH1438AB epoxy potting compound is certified to UL 94-V0. Reportedly provides lower moisture vapor transmission rate than other materials like silicones. Is a two-part epoxy resin system. Has a durometer value of 70 Shore 00; protects surface mount components during a range of temperature cycles. Is formulated to be resistant to age hardening; provides consistent durometer measurement while maintaining resistance to salt water and Fuel C.

HB Fuller, www.hbfuller.com/electronic-materials 

KISS-205 inline automated selective soldering now combines fluxing, preheating and soldering into simultaneous functions, reducing TAKT up to 50%. A PCB is fluxed and brought to preheat temperature, then sent to a second conveyor for soldering while concurrently applying flux and preheating the next PCB. Programmable features set all process parameters, including immersion depths, preheat dwells, travel distances and speeds, solder temperature and wave height. SMEMA-compatible. Offline programmable.

ACE Production Technologies, ace-protech.com

X-eye inline 6200 x-ray inspection system has speeds up to 2.5 sec. per BGA. Is available in 2D and 3D versions.

SEC, www.seceng.co.kr 

Very-High-Force Head is for odd-shaped components on Siplace SX placement machines. Places components up to 30mm high and 200mm long, with a force of up to 70N. Waffle Pack Changer available. Handles components, picked with nozzles or grippers, up to 100G. Options include OSC package for Siplace WPC 5 and WPC 6 waffle-pack changers (with nonstop modules) and Smart Pin Support.

ASM Assembly Systems, www.siplace.com

EADH Air Duster and FREH Freezer Sprays feature Halo-Olefin (HFO) technology, with a measured atmospheric lifetime of two weeks. Propellant is exempt from a number of carbon taxes imposed on HFC products.

Electrolube, www.electrolube.com

HTCX (Heat Transfer Compound Xtra) silicone-free thermal paste includes a dispersant in the formulation that reportedly increases thermally conductivity without increasing film thickness. Is smoother and provides higher thermal conductivity, lower oil bleed and lower evaporation weight loss. Is said to be humidity- and thermal cycling-resistant. For thermal coupling electrical and electronic components, and between surfaces for thermal conductivity and heat dissipation.

Electrolube, www.electrolube.com

HTCX (Heat Transfer Compound Xtra) silicone-free thermal paste includes a dispersant in the formulation that reportedly increases thermally conductivity without increasing film thickness. Is smoother and provides higher thermal conductivity, lower oil bleed and lower evaporation weight loss. Is said to be humidity- and thermal cycling-resistant. For thermal coupling electrical and electronic components, and between surfaces for thermal conductivity and heat dissipation.

Electrolube, www.electrolube.com

Material Disclosure software protects trade secrets about products and raw materials while providing supply chain traceability. Can upload reporting templates such as EICC-GeSI to a secure central database to create reports from consolidated supplier data. Works to increase response times from suppliers and automates querying suppliers on a regular basis, as well as gathering and storing data. Collects data on raw materials, including gold, tantalum, tin and tungsten. Data are collected at the bill of material level down to the substance level throughout the supply chain.

Actio, www.actio.net

Infiniium 9000 H-Series high-definition oscilloscopes come in four models with bandwidths of 250 MHz, 500 MHz, 1 GHz and 2 GHz. Offer up to 12-bit vertical resolution, 16 times the quantization levels of traditional oscilloscopes with 8 bits of resolution. Standard memory up to 100 Mpts per channel. Use a combination of hypersampling and linear noise-reduction technology to provide noise levels reportedly three times lower than traditional 8-bit oscilloscopes. N2820A and N2821A AC/DC current probes offer sensitivity down to 50uA, with a maximum current range of 5A, for measuring current consumption of battery-powered mobile devices or integrated circuits.

Agilent Technologies, www.agilent.com/find/9000H

Thermoset SC-303, SC-309 and SC-320 thermally conductive silicone encapsulants are designed for thermal conductivity for electrical/electronic encapsulating applications. Are two-component systems designed to retain properties associated with silicones. Exhibit low shrinkage and stress on components as they cure, and maintain low viscosity. Are environmentally resistant and UL-rated; are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Lord Corp., www.lord.com/electronicmaterials

Thermoset SC-303, SC-309 and SC-320 thermally conductive silicone encapsulants are designed for thermal conductivity for electrical/electronic encapsulating applications. Are two-component systems designed to retain properties associated with silicones. Exhibit low shrinkage and stress on components as they cure, and maintain low viscosity. Are environmentally resistant and UL-rated; are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Lord Corp., www.lord.com/electronicmaterials

Selective Stamp Soldering involves fitting a selective soldering machine with a custom stamp soldering nozzle with several aperture indexes around from board to board. Stamp solders small patterns on each printed circuit board. Is reportedly faster than a single nozzle selective soldering routine. Reportedly requires no modifications to selective soldering machine. Nozzle can be removed and exchanged with a standard nozzle. Processes every board in the panel in the same fashion. Has a small multi-port nozzle. A small pattern involving a connector and three other devices takes about 6 to 7 sec.

ACE Production Technologies, www.ace-protech.com