IS-I-460 inline selective soldering system handles boards up to 460 x 460 mm (18 x 18"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

IS-I-460 inline selective soldering system handles boards up to 460 x 460 mm (18 x 18"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler.

DDM Novastar, ddmnovastar.com

ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler.

DDM Novastar, ddmnovastar.com

Model 8000x SMT screen printers have an advanced-design printing table, high-precision servo motors, adjustable stencil rails and one-touch conveyor-width adjustment to ease changeovers. Come with 2-D vision system.

ESE Co. Ltd.

CN-1751-4 underfill encapsulant is reportedly crack resistant; withstands flexing experienced by flexible printed circuitry or drops and shocks of thin printed circuit assemblies. Reportedly can withstand deformation without cracking; has a modulus higher than traditional reworkable underfills. Has a CTE of 48 ppm/°C. Viscosity is 900 cps. Can be reworked at 170° to 180°C to remove underfill fillet. Underfill residue is scraped off at 170° to 180°C.

Zymet, www.zymet.com
 

Sigma Link software centralizes all data needed for programming or generated by inspection machines in the line. Can create new programs, reviews and analyze inspection data of multiple machines from the same station. Is Web-based; can access data from anywhere. Is designed to manage several user profiles.

Vi Technology, www.vitechnology.com

MC-LEDV3 pick-and-place machine features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour per IPC-9850. Accommodates flexible strips, circular boards for LED bulbs, and long LED tube boards up to 70" (1800mm) long. Places standard and domed LEDs from 1 x 0.5mm to 8 x 8mm, with positive air pressure and Teflon-coated nozzles to aid release of "sticky" components. Feeders specially designed for LED assembly.

Manncorp, www.manncorp.com

Elite performs part library teaching and various recognition tests offline under the recognition environment identical to that of a chip mounter. Is said to improve parts placement quality and increase productivity of the machine by minimizing machine operation loss caused by the part registration and the possibility of defective recognition.

Samsung Techwin, www.samsung-smt.com

Excen chipshooter is rated at 120,000 cph (optimum). Features rotary modular head, side-view vision, of pre- and post-part placement monitoring, mixed production of different boards, nonstop changeover of device types, and auto-splicing and autoloading. Is 1.25m long.

Samsung Techwin, www.samsung-smt.com

QFusion fuses traditional burn-in and HASS within a single system. Has a footprint of 81.5” x 38.4” x 102”. Has 6 compartments, each with a vibration table, and provides a thermal ramp rate of 60°C/min. average. Employs hot and cold temperature, rapid thermal ramps and repetitive shock vibration. Features increased energy level in the lower frequency bands, which manifests unwanted weaknesses in a product. HASS screens failures that may have gone undetected during traditional burn-in testing processes. Subjects product to outer margins of temperature, rapid thermal cycling, and vibration testing—simultaneously—to uncover design weaknesses.

Qualmark, qualmark.com

FuzionXC2-37 and FuzionXC2-60 reportedly have more than twice the feeder inputs of other surface mount machines. Have NPI software tools featuring icon-driven interface and efficiency tools, including online component auto-teach and on-the-fly production editing. Ion feeders have top-loading design that reportedly reduces replenishment and changeover times by 50%. Combine high-speed chip to odd-form placements – from 01005 passive components up to 150mm connectors – with 5kg placement force and parts up to 25mm tall. FuzionXC2-37 accommodates boards up to 1300mm x 610mm, 272 8mm feeder inputs, and input types including strip, tape, tube, odd-form, and tray. The FuzionXC2-60 has 264 8mm feeder inputs.

Universal Instruments, www.uic.com